# saurasemi

> Pioneering Semiconductor & Substrate Manufacturing for the AI‑Driven Era


## Posts

- [AUO Showcases Micro LED Optical Communication and Glass Core Substrates Technologies at SEMICON Taiwan 2026](https://www.saurasemi.com/2026/09/05/auo-showcases-micro-led-optical/): As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry growth. Targeting key technologies at the forefront of AI infrastructure, AUO will showcase its latest advancements in optical communications and advanced semiconductor packaging at SEMICON Taiwan 2026, taking place September 2-4.
- [Advanced PVD Coating Technology: Redefine Surface Performance for Modern Industries](https://www.saurasemi.com/2026/08/28/advanced-pvd-coating-technology-redefine-surface-performance-for-modern-industries/): In the era of high-precision manufacturing and premium product upgrading, surface treatment technology has become a core factor determining product durability, aesthetics and functional stability. Physical Vapor Deposition (PVD), as an advanced vacuum thin-film coating technology, has gradually become the preferred surface enhancement solution for global high-end industries, relying on its pure physical deposition mechanism and superior coating performance. Different from traditional coating and chemical deposition processes, PVD achieves surface modification through precise physical phase transformation, bringing unprecedented comprehensive benefits to various substrates.
- [Primemas at FMS 2026: CXL Full-Stack Products and Micron Collaboration on the Abaco Project](https://www.saurasemi.com/2026/08/20/primemas-at-fms-2026-cxl-full-stack-products-and-micron-collaboration-on-the-abaco-project/): Primemas Inc. showcased its latest CXL memory innovations at the Future of Memory and Storage (FMS) 2026. At the event, the company highlighted the industry’s most comprehensive CXL memory portfolio and its strategic collaboration with Micron on the Abaco Project, a rack-scale compute system with over 100TB of CXL-attached shared and pooled memory developed for the Department of Energy’s Pacific Northwest National Laboratory (PNNL) to power next-generation, large-scale scientific AI, HPC and data-intensive workloads. The Abaco Project is supported by DOE’s Office of Science, Advanced Scientific Computing Research program.
- [Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers](https://www.saurasemi.com/2026/08/20/agentrys-raises-24-5-million-to-build-agentic-design-automation-for-chipmakers/): Agentrys, a startup focused on automating and continuously improving chip design, today announced that it has raised $24.5 million in funding. The total comprises an oversubscribed $19.1 million seed round led by Etna Labs, following a $5.4 million pre-seed led by MediaTek, the company’s first strategic backer. The new funding will go toward recruiting, agent-native tooling, and expanding customer engagements across verification and physical design.
- [MetaOptics and Elsoft Partner to Scale Next-Generation Semiconductor Optics Manufacturing Equipment](https://www.saurasemi.com/2026/08/15/metaoptics-and-elsoft-partner-to-scale-next-generation-semiconductor-optics-manufacturing-equipment/): MetaOptics Ltd and Elsoft Research Berhad today jointly announced a strategic partnership to co-develop and mass produce the next generation of 12-inch large format precision, high speed metalens laser writers and leading-edge automatic testers that could sort metalens across widely applied wavelengths from visible light 425 ~ 630nm, in-frared 740 ~ 940nm and 1245 ~ 1310nm.
- [Pusan National University Reports an Adaptive Organic Transistor for Wearable Electronics](https://www.saurasemi.com/2026/08/15/pusan-national-university-reports-an-adaptive-organic-transistor-for-wearable-electronics/): Wearable electronics are gradually evolving from simple sensors into featureful devices that can make basic decisions and support medical care in real time. To fully realize this vision, wearable systems must be soft and versatile to adapt naturally to the body while performing tasks, without sacrificing comfort or reliability. Creating such electronics that combine flexibility and computing in a single device remains a difficult challenge.
- [Wearable Sensors and AI Could Monitor Blood Pressure in ICU](https://www.saurasemi.com/2026/08/15/wearable-sensors-and-ai-could-monitor-blood-pressure-in-icu/): Wearable sensors coupled with AI can generate blood pressure readings nearly as well as the invasive and risky arterial lines relied on in intensive care units and operating rooms, new work by Johns Hopkins University researchers demonstrates.
- [Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth](https://www.saurasemi.com/2026/08/09/intel-announces-leadership-appointment/): Intel Corporation today announced the appointment of Dean Jarnac as executive vice president and chief sales officer. Jarnac will lead Intel’s global sales organization—strengthening Intel’s customer relationships and go-to-market execution across its product portfolio, including client, data center, AI, networking, and ASICs.
- [The Full Workflow of Modern Chip Processing Technology](https://www.saurasemi.com/2026/08/06/the-full-workflow-of-modern-chip-processing-technology/): Modern semiconductor chip manufacturing is a highly sophisticated, ultra-precise industrial system that integrates micro-nano processing, precision testing and intelligent supply control.
- [SEMI Reports Worldwide Silicon Wafer Shipments Increase 7.4% Year-on-Year in Q2 2026](https://www.saurasemi.com/2026/08/05/semi-reports-worldwide-silicon-wafer-shipments-increase-7-4-year-on-year-in-q2-2026/): The SEMI Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025. Shipments increased 9.1% quarter-over-quarter from the 3,275 MSI recorded during the first quarter of 2026.
- [IBM and The University of Chicago Demonstrate Quantum Advantage](https://www.saurasemi.com/2026/08/05/ibm-and-the-university-of-chicago-demonstrate-quantum-advantage/): IBM (NYSE: IBM) and researchers from the University of Chicago today announced a demonstration in quantum computing that achieves the fundamental criteria for quantum advantage: performing computations beyond the reach of leading classical simulation methods while providing trust that the computation returned accurate results.

## Pages

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## Products

- [Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series](https://www.saurasemi.com/product/multi-photon-3d-laser-direct-write-lithography-system-sa-mpd-series/): The SA-MPD series are true 3D maskless multi-photon 3D laser direct-write lithography systems. They fabricate arbitrary nanoscale three-dimensional structures and deliver high-precision 3D manufacturing solutions for micro-nano optics, microfluidic chips, on-chip optical interconnections and micromechanics. They support diverse photoresist and functional materials, and integrate auto-focusing, adaptive slicing, fiducial marking and tilt-compensation capabilities.
- [Ultraviolet Laser Direct-Write Lithography System SA-AOD-M1000](https://www.saurasemi.com/product/ultraviolet-laser-direct-write-lithography-system-sa-aod-m1000/): The SA-AOD UV Laser Direct-Writing System is a maskless lithography tool for micro-nano structuring. It uses an acousto-optic deflector (AOD) for inertia-free high-speed UV laser scanning. Without photomasks, it directly exposes high-precision micro-patterns on photoresist-coated substrates including optical glass, silicon wafers and other semiconductor & optical planar materials.Ideal for R&D and mass production of DOE, MEMS and other micro-nano devices, it delivers reliable process solutions for micro-nano optics, semiconductors and microelectronics.
- [Digital Projection Maskless Lithography System SA-UVD](https://www.saurasemi.com/product/digital-projection-maskless-lithography-system-sa-uvd/): The SA-UVD digital projection maskless lithography system adopts digital micro-mirror technology for high-speed maskless pattern generation, achieving a minimum feature size of 500 nm. Equipped with high-precision real-time focusing and visual alignment overlay technology, it is mainly used for rapid prototyping in the fields of MEMS, photonic devices, quantum computing chips, and sensors.
- [Tomographic Volumetric Bioprinting System SA-VOP](https://www.saurasemi.com/product/tomographic-volumetric-bioprinting-system-sa-vop/): Based on 3D tomographic scanning reconstruction technology, it applies advanced scanning modes and dose optimization algorithms to realize ultra-high-speed processing of arbitrary 3D structures with an efficiency improvement of 50-300 times. It supports a variety of bioinks and cell-laden materials, making it an optimal choice for biofabrication.
- [Contact Thickness Measurement Gauge SA-CG12](https://www.saurasemi.com/product/contact-thickness-measurement-gauge-sa-cg12/): The SA-CG12 Contact thickness measurement gauge uses a high-precision thickness measurement instrument and is equipped with a high-precision marble reference measuring table. It is an ideal solution for high-precision wafer thickness measurement, as shown in the figure below.
- [Vacuum Die Bonder SA-WB061](https://www.saurasemi.com/product/vacuum-die-bonder-sa-wb061/): The SA-WB061 Vacuum Die Bonder is a device designed for the temporary bonding of wafers to substrates. It is capable of fixing and bonding wafers with a diameter of 150 mm or less, and is mainly composed of a vacuum unit, heating unit, cooling unit, airbag pressurizing unit, and other components, as illustrated in the figure below.
- [Vertical dryer SA-VLD-48LS](https://www.saurasemi.com/product/vertical-dryer-sa-vld-48ls/): SA-VLD-48LS is driven by high-performance brushless motors for stable operation. It adopts nitrogen sealing to maintain a pure internal environment. Integrating multiple processing functions, it efficiently removes residues and particles. Built with static elimination and self-reset designs, it features comprehensive safety protection, perfectly adapting to high-standard semiconductor production.
- [Horizontal dryer SA-HLD-48LS](https://www.saurasemi.com/product/horizontal-dryer-sa-hld-48ls/): SA-HLD-48LS adopts intelligent control for easy and reliable operation. The rotating shaft is sealed with nitrogen to isolate the internal space effectively. Its precisely calibrated rotating structure runs steadily with low wafer damage risk. Equipped with auxiliary heating, it delivers thorough drying performance, fully meeting the strict cleanliness requirements of semiconductor production.
- [Fully automatic single wafer cleaner SA-SWC-48LS](https://www.saurasemi.com/product/fully-automatic-single-wafer-cleaner-sa-swc-48ls/): SA-SWC-48LS is suitable for various semiconductor materials and compatible with multiple wafer sizes. The optimized chamber creates a stable working environment and prevents cross-contamination of chemicals. It supports mainstream industrial protocols and system connection. With outstanding adaptability, it meets diverse etching and cleaning demands in semiconductor manufacturing.
- [Fully automatic cassette cleaning manchine SA-CCM-48LS](https://www.saurasemi.com/product/fully-automatic-cassette-cleaning-manchine-sa-ccm-48ls/): SA-CCM-48LS adopts flame-retardant material with excellent leakproof performance. It is equipped with comprehensive safety interlock and alarm systems for secure operation. Featuring stable running performance and low failure rate, it can connect with management systems. Following strict industrial standards, it delivers long-term reliable service for semiconductor supporting production.
- [Fully automatic furnace tube cleaning manchine SA-FTCM-48LS](https://www.saurasemi.com/product/fully-automatic-furnace-tube-cleaning-manchine-sa-ftcm-48ls/): SA-FTCM-48LS adopts high-performance materials to endure acidic corrosive environments. It supports flexible operation modes and features automatic rotation and flushing functions. The chemical solution can be recycled to cut costs. All circuits and components are professionally treated for corrosion resistance, with reliable air protection. It operates safely and stably, complying with industry norms for semiconductor production.
- [Fully automatic de-edge cleaning manchine SA-DECM-48LS](https://www.saurasemi.com/product/fully-automatic-de-edge-cleaning-manchine-sa-decm-48ls/): SA-DECM-48LS adopts vacuum handling structure for stable wafer conveying and precise edge trimming. It features fully automated loading and unloading and water recycling design for energy conservation. Key electrical parts are treated with anti-corrosion measures and gas protection. With reliable control system and perfect leakproof design, it operates safely and conforms to semiconductor industrial standards.
- [Fully automatic after gringing cleaning manchine SA-AGCM-48LS](https://www.saurasemi.com/product/fully-automatic-after-gringing-cleaning-manchine-sa-agcm-48ls/): SA-AGCM-48LS is made of high-grade materials to resist acidic corrosive environments. It adopts mature processes to effectively remove grinding residues on wafer surfaces. Equipped with automated manipulators and modular tank structure, it ensures steady operation and uniform processing results. With advanced control configurations and sound leak-proof design, it supports intelligent management and delivers reliable performance for semiconductor production.
- [Fully automatic final cleaning manchine SA-FCM-48LS](https://www.saurasemi.com/product/fully-automatic-final-cleaning-manchine-sa-fcm-48ls/): SA-FCM-48LS adopts advanced cassette-less transmission and professional drying technologies to finally remove surface contaminants. It applies megasonic circulation cleaning for superior cleaning quality. The equipment supports connection with management systems and maintains excellent particle and metal ion control. It runs stably and efficiently, fully meeting the strict final cleaning standards for semiconductor wafers.
- [Fully automatic wafer etching manchine SA-WEM-48LS](https://www.saurasemi.com/product/fully-automatic-wafer-etching-manchine-sa-wem-48ls/): SA-WEM-48LS features a specially designed rotating mechanism for steady immersion processing. It delivers highly uniform etching results and adopts circulating filtration to reuse chemical liquids. With intelligent temperature control and gas regulating functions, it works efficiently. It supports data interconnection with management systems and has comprehensive protection designs to safeguard wafers during operation.
- [Fully automatic RCA cleaning manchine SA-RCA-48LS](https://www.saurasemi.com/product/fully-automatic-rca-cleaning-manchine-sa-rca-48ls/): SA-RCA-48LS is crafted with premium materials to endure acidic corrosive working environments. Adopting modular tank design and advanced automatic manipulators, it delivers stable and consistent cleaning performance for semiconductor wafers. Equipped with high-end control components and compatible with MES systems, it realizes intelligent operation. With reliable leakage prevention and optimized ventilation design, it ensures safe, efficient and eco-friendly operation, perfectly meeting the rigorous cleaning demands of the semiconductor industry.
- [Fully automatic Nickel and Gold Plating Cleaning Machine SA-NAGP-48LS](https://www.saurasemi.com/product/fully-automatic-nickel-and-gold-plating-cleaning-machine-sa-nagp-48ls/): SA-NAGP-48LS features durable imported materials to adapt to acidic corrosive working conditions. It adopts fully automatic operation to deliver stable cleaning performance for wafers after nickel and gold plating. The professional constant temperature system ensures precise temperature control. All electrical parts are treated with anti-corrosion technology. Compatible with industrial management standards, it runs safely and reliably to meet sophisticated semiconductor production requirements.
- [Indium Evaporation System SA-VKT550I](https://www.saurasemi.com/product/indium-evaporation-system-sa-vkt550i/): SA-VKT550I is a custom-built thermal resistance evaporation platform, specially optimized for ultra-precise indium bump formation. Boasting consistent reliable output, comprehensive automated operation and low upkeep costs, it fully satisfies stringent process standards for advanced flip-chip interconnection and bonding.
- [Resistance Evaporation System SA-VKT360](https://www.saurasemi.com/product/resistance-evaporation-system-sa-vkt360/): SA-VKT360 is a space-saving evaporation platform integrating electron beam and resistance thermal evaporation technologies. It features complete process functions, full automatic operation and low maintenance workload, catering to academic R&D experiments and small-volume pilot production.
- [Electron Beam Evaporation System SA-VKE550/E800](https://www.saurasemi.com/product/electron-beam-evaporation-system-sa-vke550-e800/): SA-VKE550 and SA-VKE800 are general-purpose electron-beam evaporation systems. Delivering high-performance, stable and reliable operation, they feature advanced automated control routines and low-maintenance design to fulfill versatile requirements for both mass production and experimental platforms.
- [Electron Beam Evaporation System SA-VKE360](https://www.saurasemi.com/product/electron-beam-evaporation-system-sa-vke360/): SA-VKE360 is a space-saving evaporation platform integrating electron beam and resistance thermal evaporation technologies. It features complete process functions, full automatic operation and low maintenance workload, catering to academic R&D experiments and small-volume pilot production.
- [Electron Beam Evaporation System SA-VKE500D](https://www.saurasemi.com/product/electron-beam-evaporation-system-sa-vke500d/): SA-VKE500D is a research-grade electron beam evaporation platform. Featuring an interworking dual-chamber loadlock design where the upper and lower cavities serve as mutual loadlock units, it overcomes the technical bottleneck of loadlock integration for evaporators. The system fully meets process requirements for medium-small batch production and advanced experimental research platforms.
- [Electron Beam Evaporation System SA-VKE1100/E1500](https://www.saurasemi.com/product/electron-beam-evaporation-system-sa-vke1100-e1500/): SA-VKE1100 and SA-VKE1500 are mass-production electron beam evaporation platforms. Equipped with a wide uniform coating region, they deliver consistent stable operation, complete automated control and low maintenance costs, perfectly catering to high-throughput evaporation processes for oversized substrates and workpieces. Feature Low cost Lift-off Co-deposition High evaporation rate Application Laser R&D Intergated circuit MEMS Specifications： Parameter Descriptions Number of Crucibles 8(max.) Power Supply 10kW(max.) Film thickness monitoring Crystal oscillator controller Ion Source RF & Kaufman & Hall ion source Fixture types Dome & Knudsen & Planetary Pumping System Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump Coating Uniformity ±2% Coating Repeatability ±2% Uniform Deposition Area Ø300 mm(max.) Ultimate Vacuum 2E-5Pa Vacuum Measurement Full-range vacuum gauge + ‌Capacitance diaphragm gauge Temperature Control Range RT~300℃ Space Requirements(L×W×H,m) 4.05×3.9×2.8
- [Electron Beam Evaporation System SA-VKE1100D/E1500D](https://www.saurasemi.com/product/electron-beam-evaporation-system-sa-vke1100d-e1500d/): SA-VKE1100D and SA-VKE1500D are mass-production dual-chamber electron beam evaporation systems. Featuring large coating capacity, stable running performance, full automatic control and easy maintenance, they perfectly fulfill evaporation coating demands for high-volume manufacturing and oversized workpieces.
- [Electron Beam Evaporation System SA-VKE800D](https://www.saurasemi.com/product/electron-beam-evaporation-system-sa-vke800d/): SA-VKE800D is a multi-purpose electron beam evaporation platform built for universal application. It combines outstanding performance, consistent stable running, full automatic control and low maintenance costs, fully accommodating varied e-beam evaporation workflows in industrial manufacturing and academic R&D.
- [Electron Beam Evaporation System SA-VKE1500Pro](https://www.saurasemi.com/product/electron-beam-evaporation-system-sa-vke1500pro/): SA-VKE1500Pro is a wafer-level fully-automatic electron-beam evaporation system. Equipped with an EFEM system, it delivers high-performance, stable and reliable operation alongside low-maintenance design to satisfy mass-production requirements.
- [Magnetron Sputter System SA-VKM800](https://www.saurasemi.com/product/magnetron-sputter-system-sa-vkm800/): SA-VKM800 is a high-precision magnetron sputter system. It delivers superior coating uniformity and features low-maintenance design, fulfilling both mass-production and laboratory requirements for high-precision reactive magnetron sputtering and hole-filling processes.
- [Magnetron Sputter System SA-VKM360](https://www.saurasemi.com/product/magnetron-sputter-system-sa-vkm360/): SA-VK M360 is a compact magnetron sputtering system. It features a small footprint, highly automated controls and easy-maintenance design, satisfying R&D requirements for universities and research institutes while effectively boosting R&D efficiency.
- [Magnetron Sputter System SA-VKM600/M700](https://www.saurasemi.com/product/magnetron-sputter-system-sa-vkm600-m700/): SA-VKM600 and SA-VKM700 are general-purpose magnetron sputter systems. Delivering high-performance, stable and reliable operation, they feature a high-level automated control system and easy-maintenance design to satisfy diverse magnetron sputtering process requirements for both production and R&D.
- [Multi-chamber Cluster Magnetron Sputter System SA-VKC500](https://www.saurasemi.com/product/multi-chamber-cluster-magnetron-sputter-system-sa-vkc500/): SA-VKC500 is a production-grade multi-chamber cluster magnetron sputter system. Featuring robust construction, high operational stability and reliability, as well as a highly automated control system, it is capable of meeting mass-production requirements for semiconductor-grade manufacturing.
- [Chain Magnetron Sputter System SA-VKI2000](https://www.saurasemi.com/product/chain-magnetron-sputter-system-sa-vki2000/): SA-VKI2000 is an inline production-grade magnetron sputtering system. It provides a large coating area, stable operation, a highly automated control system and low-maintenance design, satisfying mass-production requirements for sputter coating of large-size workpieces.
- [Multi-chamber Intergated System SA-VKC600](https://www.saurasemi.com/product/multi-chamber-intergated-system-sa-vkc600/): SA-SA-VKC600 is a versatile multi-chamber integrated system. Built for high performance, superior stability and reliable operation, it features a highly automated control system to satisfy diverse process-integration requirements.
- [Femtosecond Laser Micro-Nano Multi-Functional Processing Equipment for Fiber Bragg Gratings SA-FSD-1000M](https://www.saurasemi.com/product/laser-micro-nano-processing-equipment-sa-fsd-1000m/): SA-FSD-1000M Femtosecond Laser Multi-Functional Micro-Nano Processing Equipment is purpose-built for research applications. Equipped with a comprehensive set of fiber fixtures, it enables fabrication of diverse grating types on various fiber formats.
- [Femtosecond Laser 3D Micro-Nano Processing Equipment for Hard-and-Brittle Materials SA-FSD-500](https://www.saurasemi.com/product/laser-micro-nano-processing-equipment-sa-fsd-500/): SA-FSD-500 Femtosecond Laser 3D Micro-Nano Processing System adopts material modification technology to fabricate intricate patterns inside hard-and-brittle materials. It is well-suited for the preparation of 2D and 3D waveguide structures.
- [Automatic Deep Access Wire Bonder SA-DAWB-6000B](https://www.saurasemi.com/product/automatic-deep-access-wire-bonder-sa-dawb-6000b/): SA-DAWB-6000B features real-time deformation and ultrasonic monitoring, precise tail and loop control. It supports deep-access capillaries with an assist camera for easy head maintenance. Ideal for microwave modules, lasers, optical communication, sensors, MEMS and RF components, it offers high-accuracy, reliable microelectronic bonding.
- [Femtosecond Laser Micro-Nano Automatic Processing Equipment for Fiber Bragg Gratings  SA-FSD-1000IR](https://www.saurasemi.com/product/laser-micro-nano-processing-equipment-sa-fsd-1000ir/): SA-FSD-1000IR Femtosecond Laser Automatic Micro-Nano Processing Equipment is engineered for industrial mass production. Equipped with a fiber reel-based continuous feeding mechanism and a machine vision automatic alignment system, it enables high-precision femtosecond laser processing for kilometer-length optical fibers.
- [Automatic Ball Wire Bonder SA-BWB-6000Plus](https://www.saurasemi.com/product/automatic-ball-wire-bonder-sa-bwb-6000plus/): SA-BWB-6000Plus is an automatic ball wire bonder. It is equipped with programmable auto-varifocal optics, dual-frequency transducer and rigid platform. Featuring reliable motion control, advanced material handling and multi-channel EFO, it ensures consistent bonding for microwave components, lasers, optical communication, sensors, MEMS and power devices.
- [Multifunctional Manual Wire Bonder SA-MMWB-450B](https://www.saurasemi.com/product/multifunctional-manual-wire-bonder-sa-mmwb-450b/): SA-MMWB-450B is a multifunctional manual wire bonder. It delivers stable ultrasonic output with closed-loop force control and electric-driven design requiring no compressed air. It supports tailless bumping and deep-access bonding, and adapts well to soft substrates for microwave components, lasers, optical communications, sensors, MEMS and power devices.
- [Automatic Ball Wire Bonder SA-BWB-6000PC](https://www.saurasemi.com/product/automatic-ball-wire-bonder-sa-bwb-6000pc/): SA-BWB-6000PC is an automatic ball wire bonder. It features programmable auto-varifocal optics, dual-frequency transducer and rigid platform with robust motion control. Built-in advanced material transport and multi-stage EFO deliver stable bonding, suited for microwave devices, lasers, optical communication, sensors, MEMS, RF and power devices.
- [Multifunctional Manual Wire Bonder SA-MMWB-450PB](https://www.saurasemi.com/product/multifunctional-manual-wire-bonder-sa-mmwb-450pb/): SA-MMWB-450PB is a multifunctional manual wire bonder. It delivers stable ultrasonic output with closed-loop force control and electric-driven design requiring no compressed air. It supports tailless bumping and deep-access bonding, and adapts well to soft substrates for microwave components, lasers, optical communications, sensors, MEMS and power devices.
- [Multifunctional Manual Wire Bonder SA-MMWB-450PW](https://www.saurasemi.com/product/multifunctional-manual-wire-bonder-sa-mmwb-450pw/): SA-MMWB-450PW is a multifunctional manual wire bonder. It delivers stable ultrasonic output with closed-loop force control and electric-driven design requiring no compressed air. It supports tailless bumping and deep-access bonding, and adapts well to soft substrates for microwave components, lasers, optical communications, sensors, MEMS and power devices.
- [Reactive Magnetron Sputter System SA-VKV500](https://www.saurasemi.com/product/reactive-magnetron-sputter-system-sa-vkv500/): SA-VKV550 is an ion-source-enhanced reactive magnetron sputtering system. It delivers superior film quality, features a highly automated control system and low-maintenance design, and satisfies R&D and small-batch-production requirements for enterprises and research institutes.
- [Automatic Deep Access Wire Bonder SA-DAWB-6000W](https://www.saurasemi.com/product/automatic-deep-access-wire-bonder-sa-dawb-6000w/): SA-DAWB-6000W features real-time deformation and ultrasonic monitoring, precise tail and loop control. It supports deep-access capillaries with an assist camera for easy head maintenance. Ideal for microwave modules, lasers, optical communication, sensors, MEMS and RF components, it offers high-accuracy, reliable microelectronic bonding.
- [Fully Automatic Photonics Wafer Test System SA-WIT-220AL](https://www.saurasemi.com/product/fully-automatic-photonics-wafer-test-system-sa-wit-220al/): SA-WIT-220AL Fully Automatic Photonics Wafer Test System is engineered prioritizing stability, electrical noise suppression and spatial confidence, equipped with a high-precision motion control system and a premium vibration isolation system. Integrated with proprietary image processing algorithms, it enables highly stable optical characterization of small-mode-field chips and high-accuracy electrical performance measurements. Supporting fully automated wafer-scale measurement via either grating coupling or end-face coupling, the system satisfies rigorous optical test specifications and pA-level electrical signal measurement requirements. By facilitating early-stage defective chip screening at the wafer level, it prevents downstream process contamination, significantly reducing overall packaging and testing costs while enhancing production efficiency.The system has been deployed in mass production lines across domestic and international client facilities.
- [CDS/SDS Fluid supply system SA-CSFSS-48LS](https://www.saurasemi.com/product/cds-sds-fluid-supply-system-sa-csfss-48ls/): SA-CSFSS-48LS realizes centralized and automatic chemical delivery with reliable pipe sleeve structure to prevent leakage. It supports automatic formula blending and drum switching to ensure uninterrupted supply. Built with comprehensive monitoring and alarm functions, it detects abnormal conditions timely. Fully compliant with industrial specifications, it cuts manual risks and delivers stable, safe and efficient fluid supply for semiconductor production.
- [Fully automatic slot developing manchine SA-SDM-48LS](https://www.saurasemi.com/product/fully-automatic-slot-developing-manchine-sa-sdm-48ls/): SA-SDM-48LS is made of durable stainless steel with flexible operation modes. Equipped with robotic arms, it ensures consistent processing quality. It adopts nitrogen aeration and tank lifting to boost treatment efficiency. Built-in fire and static protection enhance safety. The automatic liquid supply system reduces labor input, fully complying with semiconductor production requirements. Feature Stainless Steel Automatic Fire Extinguish System Customize for Manual Fully Automatic ISO9001 Quality Assurance Application Wafer Fabrication MEMS Photonic Chips Micronano Fabrication IC Substrate Specifications： Parameter Descriptions Wafer Size 4"~6" Cleaning Capacity 25pieces2baskets or 4baskets/batch
- [Vertical Furnace SA-Flouris X201H/P](https://www.saurasemi.com/product/vertical-furnace-sa-flouris-x201h-p/): SA-FLOURIS X201H/P is a vertical batch furnace for 6/8-inch Si, SiC and GaN wafers, covering gate oxide, FOX, BPSG reflow and multi-type annealing processes. It delivers ±1℃ precise temperature control and ultra-fine film thickness uniformity below 0.6% WIW. Strict metal contamination and particle management enable stable mass production for power, logic and MEMS semiconductor manufacturing.
- [General PVD System SA-Polaris BM620](https://www.saurasemi.com/product/general-pvd-system-sa-polaris-bm620/): SA-Polaris BM620 is an automated 6/8-inch backside metallization PVD platform optimized for SiC power semiconductors. It deposits Ti, Ni, NiV and Ag for wafer rear-side metallization, precisely controlling film thickness and sheet resistance with uniformity less than 3%. Featuring compact cluster layout and robust warpage control, it achieves reliable mass production for power device back-metal processes with low particle contamination.
- [General PVD System SA-eVictor AX20P](https://www.saurasemi.com/product/general-pvd-system-sa-evictor-ax20p/): SA-eVictor AX20P is a cluster-type 6/8-inch front-side PVD system dedicated to Si/SiC power devices and advanced logic chips. It realizes sputtering deposition of Ti, TiN, AlCu, NiV and Ag for ohmic contact, barrier layer and pad metallization. With strict film uniformity below 3% and particle count under 30ea@0.3μm, the equipment has been fully validated for mass production with stable film performance and outstanding cost efficiency.
- [Fully automated, high-performance PECVD equipment SA-EPEE i200](https://www.saurasemi.com/product/pecvd-equipment-sa-epee-i200/): SA-EPEE i200 is an automated 150/200mm PECVD equipment for Si, SiC and GaAs wafers. Adopting twin-chamber design with dual-frequency RF, it deposits SiO2, SiNx, TEOS and BPSG films with ≤3% cross-wafer uniformity. Integrated with EFEM cooling and RPS in-situ cleaning, it raises throughput by 20%, cuts footprint and reduces CoC & CoO, fully optimized for mass production of power semiconductors and logic chips.
- [SiC Etcher SA-GDE C200](https://www.saurasemi.com/product/sic-etcher-sa-gde-c200/): SA-GDE C200 is a high plasma density etcher designed for 6/8-inch SiC power, MEMS and GaAs RF devices, executing SiC trench, via and mark etching. With dual-coil RF source and 2650L/s turbo pump, it reaches 6000A/min SiC etch rate. Y2O3-coated components reduce contamination, delivering long MTBC and reliable mass-production performance for wide-bandgap semiconductors.
- [SiC Etcher SA-GDE C200L](https://www.saurasemi.com/product/sic-etcher-sa-gde-c200l/): SA-GDE C200L is an upgraded high-density etcher for 6/8-inch wide-bandgap semiconductors including SiC, GaAs and InP. It supports dual clamping modes of ESC and mechanical clamp with wide temperature range from -20℃ to 300℃. Equipped with dual-frequency RF and multi-point gas injection, it features flexible process windows and reliable etching performance for diversified compound semiconductor mass production.
- [Dielectric Etcher SA-NMC508SDH/SDL](https://www.saurasemi.com/product/dielectric-etcher-sa-nmc508sdh-sdl/): SA-NMC508SDH/SDL are mature 6/8-inch dielectric etchers for logic, SiC power and MEMS manufacturing, processing SiO2 and SiNx for FEOL and BEOL steps. Featuring adjustable dual-zone gas injection and dual-zone ESC, the tools realize excellent wafer uniformity. SDL boasts higher etch rate while SDH cuts ownership cost, both with long MTBC and stable mass-production capability.
- [Metal Etcher SA-NMC508SEM](https://www.saurasemi.com/product/metal-etcher-sa-nmc508sem/): SA-NMC508SEM is a mass-production proven 6/8-inch metal etcher targeting logic, Si/SiC/GaN power and MEMS devices. It etches AlCu, W, TiN and related alloys for TM, IM and WEB processes. Equipped with dual coils and fully-automatic RF matching, it features 1600L/s high-flow pump and 350RFh long MTBC, ensuring superior etching uniformity, high throughput and low operation cost.
- [Poly-Si Etcher SA-NMC508SES](https://www.saurasemi.com/product/poly-si-etcher-sa-nmc508ses/): SA-NMC508SES is a mature 6/8-inch poly-Si etch equipment for mass production. It serves logic, BCD, Si/SiC power, MEMS and TFT chips, supporting Poly gate, STI, CT Si and other core processes. Adopting dual-zone plasma, gas injection and ceramic ESC designs, it delivers outstanding process uniformity and extended component lifespan. Most mainstream manufacturing processes have been verified in volume production with stable performance and competitive cost advantages.

## Optional

- [Agent (MCP protocol)](websites-agents.hostinger.com/www.saurasemi.com/mcp)

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