Fully Automatic Photonics Wafer Test System SA-WIT-220AL

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SKU: SA-WIT-220AL

Ā Ā Ā Ā Ā Ā SA-WIT-220AL Fully Automatic Photonics Wafer Test System is engineered prioritizing stability, electrical noise suppression and spatial confidence, equipped with a high-precision motion control system and a premium vibration isolation system. Integrated with proprietary image processing algorithms, it enables highly stable optical characterization of small-mode-field chips and high-accuracy electrical performance measurements. Supporting fully automated wafer-scale measurement via either grating coupling or end-face coupling, the system satisfies rigorous optical test specifications and pA-level electrical signal measurement requirements. By facilitating early-stage defective chip screening at the wafer level, it prevents downstream process contamination, significantly reducing overall packaging and testing costs while enhancing production efficiency.The system has been deployed in mass production lines across domestic and international client facilities.Ā 

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Description

SA-WIT-220AL Fully Automatic Photonics Wafer Test System is engineered prioritizing stability, electrical noise suppression and spatial confidence, equipped with a high-precision motion control system and a premium vibration isolation system. Integrated with proprietary image processing algorithms, it enables highly stable optical characterization of small-mode-field chips and high-accuracy electrical performance measurements. Supporting fully automated wafer-scale measurement via either grating coupling or end-face coupling, the system satisfies rigorous optical test specifications and pA-level electrical signal measurement requirements. By facilitating early-stage defective chip screening at the wafer level, it prevents downstream process contamination, significantly reducing overall packaging and testing costs while enhancing production efficiency.The system has been deployed in mass production lines across domestic and international client facilities.

Feature

Application

  • Fully automatic calibration by machine vision
  • Automatic crimping of probes/probe cards
  • Rapid auto-light alignment
  • Customizable Wafer size: 2–12 inch
  • GC/EC testing for arbitrary small-mode-spot chips
  • Automated loading/unloading and defect detection
  • Optional end-to-end testing solutions
  • Temperature range: -40ā„ƒ ~ 125ā„ƒ (wider range customizable)
  • Silicon photonics

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  • Thin-film lithium niobate(TFLN)

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  • III-V semiconductors

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  • Testing of cutting-edge technologies

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  • Testing requirements of R&D and mass production

Specification

Features

Wafer Size2″~12″

General

Loading MethodAutomatic
Loading TypeCassette/FOUP
Testing Capacity25~50 pcs/run
Wafer-IDOCR-based automatic Wafer-ID recognition with Wafer Map generation
Auxiliary ChuckEnables automatic probe cleaning, RF calibration, FA calibration, PD power/polarization calibration
Single-Probe MarkingYes
Self-CleaningYes (for wafer, Chuck, probes, FA)
Real-Time Height SensingYes
Chuck Height CalibrationYes
Chuck Positioning Accuracy±2µm
Temperature Range-40~125ā„ƒ

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