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Vacuum Die Bonder SA-WB061
In stock
SKU:
SA-WB061
| Wafer Size | 150mm, 200mm, 300mm |
|---|---|
| Functions | Timing, pressurization, heating(included), vacuum(included), cooling(included) |
| Bond Pressure | 0~3bar (adjustable) |
| Throughput | Depends on the process |
| Chamber Environment | Vacuum Pump included |
| Power Requirements | 220V, 10A |
| Equipment Power | 1KW |
| Size(L×W×H)or(D×W×H) | 650mm×600mm×350mm |
| Weight | 50kg |
| Temperature Range | RT~200℃ |
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Fully Automatic Photonics Wafer Test System SA-WIT-220AL
In stock
SKU:
SA-WIT-220AL
| Wafer Size | 2″~12″ |
|---|---|
| Loading Method | Automatic |
| Loading Type | Cassette/FOUP |
| Testing Capacity | 25~50 pcs/run |
| Wafer-ID | OCR-based automatic Wafer-ID recognition with Wafer Map generation |
| Auxiliary Chuck | Enables automatic probe cleaning, RF calibration, FA calibration, PD power/polarization calibration |
| Single-Probe Marking | Yes |
| Self-Cleaning | Yes (for wafer, Chuck, probes, FA) |
| Real-Time Height Sensing | Yes |
| Chuck Height Calibration | Yes |
| Chuck Positioning Accuracy | ±2µm |
| Temperature Range | -40~125℃ |
Vertical Furnace SA-Flouris X201H/P
In stock
SKU:
SA-Flouris X201H/P
| Wafer Size | 6″, 8″ |
|---|---|
| Process | FOX/STI Anneal/Pad-Oxide/Gate Oxide/BPSG Reflow/Final Alloy/Cu Anneal/N2 Anneal/Polyimide Cure |
| Compatible Materials | GaN, Si, SiC |
| Teamperature Control Accuracy | ≤±1℃ |
| Flat Zone Length | 860mm |
| Batch Size | 150/125 |
| SMIF/Open Cassette/OHT | Option |
| N2 Load Lock | Option |
| AGC | Option |
| Particle Control | ≤20@0.16μm |
| Uniformity(WIW/WTW/LTL) | ≤2%/1.5%/1.5% |
| Metal Contamination (ICP-MS/TXRF) | 5E10 |
| Loccalization Progress | Continuous improvement |
| Size(L×W×H)or(D×W×H) | 4093mm×900mm×3302mm, 4420mm×900mm×3302mm |
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