As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry growth. Targeting key technologies at the forefront of AI infrastructure, AUO will showcase its latest advancements in optical communications and advanced semiconductor packaging at SEMICON Taiwan 2026, taking place September 2-4.

Agentrys, a startup focused on automating and continuously improving chip design, today announced that it has raised $24.5 million in funding. The total comprises an oversubscribed $19.1 million seed round led by Etna Labs, following a $5.4 million pre-seed led by MediaTek, the company’s first strategic backer. The new funding will go toward recruiting, agent-native tooling, and expanding customer engagements across verification and physical design.

Primemas Inc. showcased its latest CXL memory innovations at the Future of Memory and Storage (FMS) 2026. At the event, the company highlighted the industry’s most comprehensive CXL memory portfolio and its strategic collaboration with Micron on the Abaco Project, a rack-scale compute system with over 100TB of CXL-attached shared and pooled memory developed for the Department of Energy’s Pacific Northwest National Laboratory (PNNL) to power next-generation, large-scale scientific AI, HPC and data-intensive workloads. The Abaco Project is supported by DOE’s Office of Science, Advanced Scientific Computing Research program.

Wearable sensors coupled with AI can generate blood pressure readings nearly as well as the invasive and risky arterial lines relied on in intensive care units and operating rooms, new work by Johns Hopkins University researchers demonstrates.

Wearable electronics are gradually evolving from simple sensors into featureful devices that can make basic decisions and support medical care in real time. To fully realize this vision, wearable systems must be soft and versatile to adapt naturally to the body while performing tasks, without sacrificing comfort or reliability. Creating such electronics that combine flexibility and computing in a single device remains a difficult challenge.

Intel Corporation today announced the appointment of Dean Jarnac as executive vice president and chief sales officer. Jarnac will lead Intel’s global sales organization—strengthening Intel’s customer relationships and go-to-market execution across its product portfolio, including client, data center, AI, networking, and ASICs.

IBM (NYSE:  IBM) and researchers from the University of Chicago today announced a demonstration in quantum computing that achieves the fundamental  criteria for quantum advantage: performing computations beyond the reach of leading classical simulation methods while providing trust that the computation returned accurate results.

The SEMI  Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025. Shipments increased 9.1% quarter-over-quarter from the 3,275 MSI recorded during the first quarter of 2026.