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Semi-automated wafer bonding platforms balancing flexible manual operation and automated process control. Well-suited for R&D, prototyping and low-volume manufacturing across semiconductor, MEMS and photonics applications.
Vacuum Die Bonder SA-WB061
In stock
SKU:
SA-WB061
| Wafer Size | 150mm, 200mm, 300mm |
|---|---|
| Functions | Timing, pressurization, heating(included), vacuum(included), cooling(included) |
| Bond Pressure | 0~3bar (adjustable) |
| Throughput | Depends on the process |
| Chamber Environment | Vacuum Pump included |
| Power Requirements | 220V, 10A |
| Equipment Power | 1KW |
| Size(L×W×H)or(D×W×H) | 650mm×600mm×350mm |
| Weight | 50kg |
| Temperature Range | RT~200℃ |