The SA-WB061 Vacuum Die Bonder is a device
designed for the temporary bonding of wafers to
substrates. It is capable of fixing and bonding
wafers with a diameter of 150 mm or less, and is
mainly composed of a vacuum unit, heating unit,
cooling unit, airbag pressurizing unit, and other
components, as illustrated in the figure below.
|
Feature |
Application |
|---|---|
|
|
Features
| Wafer Size | 150mm, 200mm, 300mm |
|---|
General
| Functions | Timing, pressurization, heating(included), vacuum(included), cooling(included) |
|---|---|
| Bond Pressure | 0~3bar (adjustable) |
| Throughput | Depends on the process |
| Chamber Environment | Vacuum Pump included |
| Power Requirements | 220V, 10A |
| Equipment Power | 1KW |
| Size(L×W×H)or(D×W×H) | 650mm×600mm×350mm |
| Weight | 50kg |
| Temperature Range | RT~200℃ |
In stock
| Bonding Accuracy | ±3 μm@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm |
| Length of Wire Bonding | ≤7mm |
| Loop Height Accuracy | ±25.4μm |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Bonding Force | 0~360g |
| Bonding Wire Type | Gold, Copper, CuPd, Ag, Alloy wire(18~50μm) |
| Bonding Speed | 45ms(2mm wire length) |
| Operating System | Windows |
| Optical System | Option between ×2~×4 and ×1.6~×3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1000mm×1300mm×1700mm |
In stock
| Bonding Accuracy | ±2 μm@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm(LF width ≤80mm) |
| Length of Wire Bonding | ≤7mm |
| Min Bond Pad Pitch | 45μm |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Wire Bonding Capacity(max.) | 30,000 wires/panel |
| Bonding Wire Type | Gold wire, copper wire, palladium-coated copper wire, silver wire, alloy wires(18~50μm) |
| Bonding Speed | 45ms(2mm wire line) |
| Operating System | Windows |
| Optical System | Option between ×2~×4 and ×1.6~×3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1000mm×1300mm×1700mm |
In stock
| Bonding Accuracy | ±3 μm@3sigma |
|---|---|
| Bonding Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: 0~180° |
| Ultrasonic | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Cavity Depth | 12mm(max.) |
| Bonding Force | 0~220g |
| Capillary Length | 16mm/19mm |
| Bonding Wire Type | Gold wire(18~75μm), copper wire (18~75 μm), selected alloy wires |
| Bonding Speed | ≥5wires/s |
| Operating System | Windows |
| Weight | 1.2T |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1500mm×1000mm×1700mm |
In stock
| Bonding Accuracy | ±3 μm@3sigma |
|---|---|
| Bonding Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: ±220° |
| Ultrasonic | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Cavity Depth | 16mm(max.) |
| Bonding Force | 0~220g |
| Capillary Length | 19mm/25mm |
| Bonding Wire Type | Gold wire(18~75μm), aluminum wire (18~75 μm), gold ribbon (12.7×50 μm ~ 25.4×300 μm), partial alloy wires |
| Bonding Speed | ≥5wires/s |
| Operating System | Windows |
| Weight | 1.2T |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1500mm×1000mm×1700mm |
In stock
| Bonding Wire Type | Au(15~75μm),Pt(18~25μm),Ag(18~50μm) |
|---|---|
| Cavity Depth | 12mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Size(L×W×H)or(D×W×H) | 640mm×620mm×450mm |
In stock
| Bonding Wire Type | Au(15~75μm),Pt(18~25μm), Cu(18~50μm),Ag(18~50μm) |
|---|---|
| Cavity Depth | 15mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Size(L×W×H)or(D×W×H) | 640mm×620mm×450mm |
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