Multifunctional Manual Wire Bonder SA-MMWB-450B

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SKU: SA-MMWB-450B

Ā Ā Ā Ā Ā Ā SA-MMWB-450B is a multifunctional manual wire bonder. It delivers stable ultrasonic output with closed-loop force control and electric-driven design requiring no compressed air. It supports tailless bumping and deep-access bonding, and adapts well to soft substrates for microwave components, lasers, optical communications, sensors, MEMS and power devices.Ā 

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Description

SA-MMWB-450B is a multifunctional manual wire bonder. It delivers stable ultrasonic output with closed-loop force control and electric-driven design requiring no compressed air. It supports tailless bumping and deep-access bonding, and adapts well to soft substrates for microwave components, lasers, optical communications, sensors, MEMS and power devices.

Feature

Application

  • Close loop force control
  • EFO controlled by CPLD
  • DSP phase lock,stable ultrasonic output
  • Drive by electricity without compressed air
  • Self-study GUl for advanced process
  • Unique tailless bumping process and super adaptability for soft substrates
  • Bond head designed by parallelogram support large module of deep access
  • Microwave components
  • Lasers
  • Optical Communication Devices
  • Sensors
  • MEMS
  • RF modules
  • SAW devices
  • Power devices
  • Discrete devices

Specification

General

Bonding Wire TypeAu(15~75μm),Pt(18~25μm),Ag(18~50μm)
Cavity Depth12mm(max.)
Capillary Length16mm/19mm
Spool Diameter1/2inch(standard), 2inches(optional)
Bonding Force1~250g
Bond PowerNumerical control,1000x subdivision
Clamping TableMaximum Temperature 200ā„ƒ
Bond Head Z Range18mm
Bond Head X-Y RangeX=15mm,Y=15mm
Lifting Table Z Range0~18mm
Weight47kg(GW.), 70kg(NW.)
Input Voltage220V±10%@50~60Hz
Power Consumption≤500W
Size(LƗWƗH)640mmƗ620mmƗ450mm

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