Automatic Ball Wire Bonder SA-BWB-6000Plus

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SKU: SA-BWB-6000Plus

Ā Ā Ā Ā Ā Ā SA-BWB-6000Plus is an automatic ball wire bonder. It is equipped with programmable auto-varifocal optics, dual-frequency transducer and rigid platform. Featuring reliable motion control, advanced material handling and multi-channel EFO, it ensures consistent bonding for microwave components, lasers, optical communication, sensors, MEMS and power devices.Ā 

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Description

SA-BWB-6000Plus is an automatic ball wire bonder. It is equipped with programmable auto-varifocal optics, dual-frequency transducer and rigid platform. Featuring reliable motion control, advanced material handling and multi-channel EFO, it ensures consistent bonding for microwave components, lasers, optical communication, sensors, MEMS and power devices.

Feature

Application

  • Dual-Frequency transducer
  • High rigidity heater block
  • High reliable motion control system
  • Programmable automatic material handling system
  • Programmable Focus Optics
  • Rigid X-Y Table system
  • Microwave components
  • Lasers
  • Optical Communication Devices
  • Sensors
  • MEMS
  • RF modules
  • SAW devices
  • Power devices
  • Discrete devices

Specification

General

Bonding Accuracy±2 μm@3sigma
Bonding StrokeX=60mm,Y=70mm(LF width ≤80mm)
Length of Wire Bonding≤7mm
Min Bond Pad Pitch45μm
Loop TypesQ-loop / SQ-loop / BGA-TWS
Spool Diameter50mm(2inches)
Wire Bonding Capacity(max.)30,000 wires/panel
Bonding Wire TypeGold wire, copper wire, palladium-coated copper wire, silver wire, alloy wires(18~50μm)
Bonding Speed45ms(2mm wire line)
Operating SystemWindows
Optical SystemOption between Ɨ2~Ɨ4 and Ɨ1.6~Ɨ3.6 times, both with programmable focus
Weight650Kg
Input Voltage220V±10%@50~60Hz
Power2KW
Compressed Air Requirement≄0.35MPa
Size(LƗWƗH)1000mmƗ1300mmƗ1700mm

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