Ā Ā Ā Ā Ā Ā SA-DAWB-6000B features real-time deformation and ultrasonic monitoring, precise tail and loop control. It supports deep-access capillaries with an assist camera for easy head maintenance. Ideal for microwave modules, lasers, optical communication, sensors, MEMS and RF components, it offers high-accuracy, reliable microelectronic bonding.Ā
SA-DAWB-6000B features real-time deformation and ultrasonic monitoring, precise tail and loop control. It supports deep-access capillaries with an assist camera for easy head maintenance. Ideal for microwave modules, lasers, optical communication, sensors, MEMS and RF components, it offers high-accuracy, reliable microelectronic bonding.
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Feature |
Application |
|---|---|
|
|
General
| Bonding Accuracy | Ā±3 Ī¼m@3sigma |
|---|---|
| Bonding Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: 0~180Ā° |
| Ultrasonic | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Cavity Depth | 12mm(max.) |
| Bonding Force | 0~220g |
| Capillary Length | 16mm/19mm |
| Bonding Wire Type | Gold wire(18~75Ī¼m), copper wire (18~75āÆĪ¼m), selected alloy wires |
| Bonding Speed | ā„5wires/s |
| Operating System | Windows |
| Weight | 1.2T |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ā„0.35MPa |
| Size(LĆWĆH) | 1500mmĆ1000mmĆ1700mm |
In stock
| Bonding Accuracy | Ā±3 Ī¼m@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm |
| Length of Wire Bonding | ā¤7mm |
| Loop Height Accuracy | Ā±25.4Ī¼m |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Bonding Force | 0~360g |
| Bonding Wire Type | Gold, Copper, CuPd, Ag, Alloy wire(18~50Ī¼m) |
| Bonding Speed | 45ms(2mm wire length) |
| Operating System | Windows |
| Optical System | Option between Ć2~Ć4 and Ć1.6~Ć3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ā„0.35MPa |
| Size(LĆWĆH) | 1000mmĆ1300mmĆ1700mm |
In stock
| Bonding Accuracy | Ā±2 Ī¼m@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm(LF width ā¤80mm) |
| Length of Wire Bonding | ā¤7mm |
| Min Bond Pad Pitch | 45Ī¼m |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Wire Bonding Capacity(max.) | 30,000 wires/panel |
| Bonding Wire Type | Gold wire, copper wire, palladium-coated copper wire, silver wire, alloy wires(18~50Ī¼m) |
| Bonding Speed | 45ms(2mm wire line) |
| Operating System | Windows |
| Optical System | Option between Ć2~Ć4 and Ć1.6~Ć3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ā„0.35MPa |
| Size(LĆWĆH) | 1000mmĆ1300mmĆ1700mm |
In stock
| Bonding Accuracy | Ā±3 Ī¼m@3sigma |
|---|---|
| Bonding Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: Ā±220Ā° |
| Ultrasonic | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Cavity Depth | 16mm(max.) |
| Bonding Force | 0~220g |
| Capillary Length | 19mm/25mm |
| Bonding Wire Type | Gold wire(18~75Ī¼m), aluminum wire (18~75āÆĪ¼m), gold ribbon (12.7Ć50āÆĪ¼m ~ 25.4Ć300āÆĪ¼m), partial alloy wires |
| Bonding Speed | ā„5wires/s |
| Operating System | Windows |
| Weight | 1.2T |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ā„0.35MPa |
| Size(LĆWĆH) | 1500mmĆ1000mmĆ1700mm |
In stock
| Bonding Wire Type | Au(15~75Ī¼m),Pt(18~25Ī¼m),Ag(18~50Ī¼m) |
|---|---|
| Cavity Depth | 12mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
In stock
| Bonding Wire Type | Au(15~75Ī¼m),Pt(18~25Ī¼m), Cu(18~50Ī¼m),Ag(18~50Ī¼m) |
|---|---|
| Cavity Depth | 15mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
In stock
| Bonding Wire Type | Al(18~100Ī¼m),Au(15~75Ī¼m), Gold Ribbon(12.7 Ć 50Ī¼m~25.4 Ć 300Ī¼m),specific alloy wire |
|---|---|
| Cavity Depth | 21mm(max.) |
| Capillary Length | 19mm/25mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
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