SAURA Semi Official Website Product FAQ

1. Brand & Product Line Basics

Q1: What semiconductor equipment does SAURA Semi mainly provide?

A: SAURA provides full-process semiconductor manufacturing equipment covering wafer pretreatment, thin-film deposition & etching, packaging, testing and supporting supply systems. The complete product portfolio includes six core categories:

• Substrate Preparation: Wafer cleaning machines and dryers
• Fabrication Equipment: Etchers (Poly-Si, Metal, Dielectric, SiC), CVD, PVD systems (Magnetron Sputtering, Electron Beam Evaporation, Resistance Evaporation, Indium Evaporation), vertical furnaces and developing machines
• Packaging Equipment: Full-automatic wire bonders including deep-access and ball wire bonders
• Testing Equipment: Wafer test systems
• Supply Systems: Fluid supply systems

All devices are independently developed automatic models, suitable for laboratory, pilot and mass production scenarios. Hot in-stock models include SA-EPEE i200 PECVD, SA-WEM-48LS wafer etching & cleaning machine, SA-VKC600 multi-chamber integrated PVD, full-series wire bonders and SA-CSFSS-48LS fluid supply system.

Q2: What is the naming rule for SAURA equipment models?

A: All models adopt the unified coding rule: SA-Series Abbreviation-Specification:

• SA-WEM: Fully automatic wafer etching & cleaning equipment
• SA-EPEE: High-performance PECVD deposition equipment
• SA-VKC: Multi-chamber integrated general PVD system
• SA-BWB: Automatic ball wire bonder
• SA-DAWB: Automatic deep-access wire bonder
• SA-CSFSS: Wafer fluid supply system

Suffix numbers represent processing size and production capacity; suffixes such as Plus, PC, B and W stand for upgraded functional versions. Each SKU corresponds to an independent inventory code for direct purchasing and ordering.

Q3: What wafer substrates and sizes do SAURA devices support?

A: Standard models are compatible with silicon wafers, SiC, glass substrates and compound semiconductors. They support 4/6/8-inch wafer platforms with customized services for ultra-thin and special-shaped substrates. Free sample process verification is available before ordering.

2. Process Equipment Technical FAQs

2.1 Cleaning & Etching Equipment

Q4: What are the core differences between cleaning machines and etchers?

A:

• Cleaning Machines (SA-WEM Series): Remove surface particles, photoresist and metal residues on wafers via wet/dry cleaning processes throughout the manufacturing flow to improve production yield.
• Etchers: Specialized in precise thin-film pattern etching, divided into four types:
• Poly-Si Etcher: For polysilicon gate patterning
• Metal Etcher: For metal interconnection layer etching (Ti, Al, TiN)
• Dielectric Etcher: For oxide/nitride dielectric via etching
• SiC Etcher: Dedicated for third-generation semiconductor silicon carbide power devices

Q5: What advantages does the SiC Etcher have over ordinary silicon etching equipment?

A: SAURA SiC Etcher is optimized with customized halogen gas ratio, featuring high etching selectivity and low surface roughness. It supports high-temperature continuous stable processing, eliminates carbon residue contamination, and is perfectly adapted for automotive power devices, IGBTs and RF chip mass production.

2.2 PVD & CVD Deposition Equipment

Q6: How to choose between CVD and PVD equipment?

A:

• CVD (SA-EPEE i200 PECVD): Realizes thin-film deposition through chemical gas reaction. Ideal for silicon oxide/silicon nitride passivation layers and polysilicon thin films. Low-temperature PECVD is applicable for back-end metal layer fabrication, while vertical furnace CVD is used for front-end oxidation and annealing processes.
• PVD Series: Adopts physical sputtering and evaporation coating with low-temperature process without device damage, including four sub-systems:
• Magnetron Sputtering System: Preferred for mass production of Al, Cu, Ti and barrier metal layers
• Electron Beam Evaporation System: For high-precision precious metal and optical thin films
• Resistance & Indium Evaporation System: Specialized for infrared devices and low-temperature solder thin films

Q7: What are the highlights of the SA-VKC600 multi-chamber integrated PVD system?

A: This all-in-one system integrates pre-cleaning, sputtering, cooling and transmission chambers with fully automatic vacuum wafer transfer. It avoids particle contamination caused by repeated vacuum breaking, achieves thin-film uniformity within 3%, and supports continuous mass production of chips and MEMS devices.

2.3 Wire Bonding Packaging Equipment

Q8: What is the application difference between SA-BWB ball bonders and SA-DAWB deep-access bonders?

A:

• SA-BWB Series (PC/Plus): Universal for consumer electronics and memory chip packaging, supporting gold and copper ball bonding. The Plus model improves bonding speed, while the PC model upgrades high-precision visual positioning.
• SA-DAWB Series (B/W): Designed for high-power semiconductors and IGBT modules. It enables deep-cavity wire bonding for thick packaging housings with large depth dimensions.

Q9: Can automatic wire bonders support customized bonding materials?

A: Standard models are compatible with gold, copper and aluminum wires. Custom palladium and silver alloy wire processes are available by replacing bonding heads and adjusting process programs. The equipment supports batch program storage for fast product switching.

2.4 Auxiliary & Supporting Equipment

Q10: What is the function of the SA-CSFSS-48LS fluid supply system?

A: It stably delivers high-purity process liquid and carrier gas for cleaning and etching equipment, with precise control of flow rate, temperature and pressure. Equipped with a multi-stage filtration module, it reduces chamber contamination and supports full wet-process production line matching.

Q11: Applications of vertical furnaces, developing machines and wafer test systems?

A:

• Vertical Furnace: High-temperature oxidation, diffusion and annealing for 6/8-inch wafer batch heat treatment
• Developing Machine: Photoresist pattern development after lithography process
• Wafer Test System: Pre-packaging electrical probe testing to screen defective dies and reduce packaging loss

3. Purchasing, Inventory & Delivery

Q12: What is the delivery time for in-stock products?

A: All products marked In Stock (wire bonders, PECVD, PVD, wafer cleaning & etching machines) can be delivered within 3–15 working days. Customized chamber and special-spec equipment takes 3–6 months. Precise production scheduling will be provided before order confirmation.

Q13: Is free sample testing supported before purchase?

A: Yes. Customers can send wafer samples to our laboratory for free process testing. We will provide official test reports including film thickness, etching rate and bonding tension data to verify process compatibility before contract signing.

Q14: Does SAURA provide full-turnkey production line solutions?

A: Yes. We support one-stop full-line equipment matching, covering wafer pretreatment → etching & deposition → wire bonding packaging → wafer testing. Professional engineers provide customized factory layout, water & electricity configuration and clean room matching solutions according to customer product types (logic chips, SiC power devices, MEMS, optoelectronic devices).

Q15: Are spare parts and consumables available for separate purchase?

A: Full-series original spare parts and consumables are in long-term stock, including PVD targets, etching gas accessories, bonding nozzles, fluid filter elements and chamber seals. Tiered discounts are available for bulk purchases.

4. Installation, After-sales & Maintenance

Q16: What services are included after equipment delivery?

A: Complete after-sales supporting services are included:

• On-site clean room installation, wiring and vacuum debugging by professional engineers
• 7–15 days of on-site training for equipment operation, process programming and daily maintenance
• Complete operation manuals, process parameter templates and factory acceptance reports
• 1-year full-machine warranty and 2-year warranty for core chamber components

Q17: What is the after-sales fault response mechanism?

A: 7×24-hour online technical support for remote diagnosis and debugging. On-site engineer service within 24 hours for local areas and 48 hours for remote areas. Adequate core spare parts inventory minimizes equipment downtime. Extended warranty and annual factory maintenance packages are available.

Q18: Can old SAURA equipment be upgraded?

A: Yes. We provide hardware and software upgrade services, including automatic wafer transmission system, high-definition visual positioning and intelligent process control optimization. Single-chamber PVD equipment can be renovated into multi-chamber integrated systems to improve production capacity and process accuracy.

5. Purchasing Policy & General Inquiry

Q19: How to obtain detailed product quotations and specification sheets?

A: Contact our online customer service, provide your wafer size, process requirements and annual production capacity demands, and you will get complete PDF datasheets, detailed quotations and customized delivery solutions.

Q20: Does SAURA support global export business?

A: Yes. We support worldwide equipment export, providing complete commodity inspection, certificate of origin and professional export packaging solutions. Full set of customs clearance technical documents is provided for global laboratory and semiconductor factory procurement.

Q21: What are the benefits of the SAURA Shopping Event?

A: The seasonal promotion covers all core products including cleaning machines, etchers, PVD and wire bonders. Pre-order customers can enjoy exclusive discounts and free consumable packages. In-stock products support instant price locking during the event period.

Q22: What items are included in equipment acceptance inspection?

A: Double acceptance (factory pre-acceptance + on-site final acceptance) includes vacuum performance, temperature & pressure stability, film uniformity, etching rate & selectivity, bonding tension strength, production capacity verification and safety interlock system inspection. Equipment will be officially delivered only after all indicators meet standards.

6. Technical General Questions

Q23: How to distinguish R&D laboratory models and mass production models?

A: Standard compact models without production suffixes are designed for laboratory small-batch R&D, featuring small footprint and flexible process switching. Models with suffixes such as i, 6000 and 48LS are mass-production versions, supporting full-automatic continuous operation and 7×24-hour non-stop production.

Q24: What clean room environment requirements do SAURA devices have?

A: Standard equipment adapts to Class 1000 / Class 100 clean rooms. All devices are equipped with built-in primary particle filtration systems. We provide customized clean air cabinet renovation services and on-site factory environment survey solutions for non-standard clean rooms.

Q25: Can one machine process both silicon wafers and SiC wafers?

A: The basic chamber hardware is universal for silicon and SiC substrates, requiring replacement of special trays, gas pipelines and optimization of plasma process parameters. For long-term SiC mass production, we recommend dedicated SiC etching chambers to avoid cross-contamination and ensure device yield.