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Automatic Ball Wire Bonder SA-BWB-6000PC

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SKU: SA-BWB-6000PC
Bonding Accuracy±3 μm@3sigma
Bonding StrokeX=60mm,Y=70mm
Length of Wire Bonding≤7mm
Loop Height Accuracy±25.4μm
Loop TypesQ-loop / SQ-loop / BGA-TWS
Spool Diameter50mm(2inches)
Bonding Force0~360g
Bonding Wire TypeGold, Copper, CuPd, Ag, Alloy wire(18~50μm)
Bonding Speed45ms(2mm wire length)
Operating SystemWindows
Optical SystemOption between Ɨ2~Ɨ4 and Ɨ1.6~Ɨ3.6 times, both with programmable focus
Weight650Kg
Input Voltage220V±10%@50~60Hz
Power2KW
Compressed Air Requirement≄0.35MPa
Size(LƗWƗH)1000mmƗ1300mmƗ1700mm

Automatic Ball Wire Bonder SA-BWB-6000Plus

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SKU: SA-BWB-6000Plus
Bonding Accuracy±2 μm@3sigma
Bonding StrokeX=60mm,Y=70mm(LF width ≤80mm)
Length of Wire Bonding≤7mm
Min Bond Pad Pitch45μm
Loop TypesQ-loop / SQ-loop / BGA-TWS
Spool Diameter50mm(2inches)
Wire Bonding Capacity(max.)30,000 wires/panel
Bonding Wire TypeGold wire, copper wire, palladium-coated copper wire, silver wire, alloy wires(18~50μm)
Bonding Speed45ms(2mm wire line)
Operating SystemWindows
Optical SystemOption between Ɨ2~Ɨ4 and Ɨ1.6~Ɨ3.6 times, both with programmable focus
Weight650Kg
Input Voltage220V±10%@50~60Hz
Power2KW
Compressed Air Requirement≄0.35MPa
Size(LƗWƗH)1000mmƗ1300mmƗ1700mm