Ā Ā Ā Ā Ā Ā SA-VKE1500Pro is a wafer-level fully-automatic electron-beam evaporation system. Equipped with an EFEM system, it delivers high-performance, stable and reliable operation alongside low-maintenance design to satisfy mass-production requirements.Ā
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Feature |
Application |
|---|---|
|
|
Principleļ¼
Features
| Number of Crucibles(max.) | 8 |
|---|---|
| Uniform Deposition Area(max.) | 12ĆĆ200āÆmm |
| Ultimate Vacuum | 2E-5Pa |
General
| Power Supply(max.) | 10kW |
|---|---|
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | RF & Kaufman & Hall ion source |
| Fixture types | Dome & Knudsen & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~200ā |
| Size(LĆWĆH) | 8.5mĆ5.5mĆ3.3m |
In stock
| Processing Position | Patterned material modification and waveguide structures |
|---|---|
| Wavelength | 1030nm, 515nm |
| Objective Lens | 50Ć/20Ć |
| Illumination | Reflection & Transmission |
| Functional Configuration | External energy adjustment, 2D motorized slit |
| Optional | Spatial Light Modulator (SLM), auto-focus tracking |
| Adjustment Stage | Manual |
| Travel Range of Motion Stage | 200āÆmm Ć 200āÆmm |
| Fixture & Workstation | Large-area transparent adsorption stage |
In stock
| Number of Cathodes(max.) | 4 |
|---|---|
| Sputtering Power Supply | DC / RF / pulsed DC, freely switchable |
| Ion Source | RF & Kaufman & Hall ion source |
| Bias | RF / pulsed DC |
| Vacuum Sampling Chamber | optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | Ā±3% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć150āÆmm |
| Vacuum Measurement | Full-range vacuum gauge + āCapacitance diaphragm gauge |
| Ultimate Vacuum | 1E-5Pa |
| Temperature Range | RT~300ā |
| Size(LĆWĆH) | 1.6mĆ2.75mĆ1.8m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | PolySi, Si |
| Processes | Poly EB/STI/Poly gate/CT Si |
| Coil | Dual Zone |
| Match Mode | L-Match |
| Magnetic Shield | Yes |
| Gas Injector | Dual Zone |
| FRC | Yes |
| Liner | Symmetric Grid |
| Edge Ring | CIP version |
| ESC | Dual Zone |
| ESC Materials | Ceramic |
| Lift Pin | Ceramic |
| Turbo | 1600L/s |
| Chamber | Symmetric |
| Size(LĆWĆH) | 3279mmĆ3253mmĆ2339mm |
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