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Ultraviolet Laser Direct-Write Lithography System SA-AOD-M1000
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SKU:
SA-AOD-M1000
| Wavelength | 375nm, 405nm |
|---|---|
| Minimum Feature Size | 300nm |
| Overlay Accuracy | 300nm |
| Focusing Range | 100 μm |
| Long-term Power stability | ±1% |
| Maximum Supported Substrate Size | 8-inch standard wafer, 200 mm × 200 mm planar substrate |
| Supported Substrate Thickness | 0.1 mm ~ 15 mm |
| Maximum Exposure Area | 200 mm × 200 mm |
| Temperature Control Stability | ±0.1°C (core optical cavity constant temperature control) |
| Exposure Grayscale Level | 4096 levels, wi th high-precision exposure dose closed-loop control |
| UV Special Objective Lens | Optional magnification: 5×, 10×, 20×, 50×, 100×; flat-field apochromatic design for UV band; core numerical aperture (NA) fully matches the resolution requirements of each magnification. |
| Pattern Writing Layout Data Preprocessing Software | Supports industry-standard vector layout formats including GDSII and OASIS; provides compatible conversion and preprocessing for bitmap formats (JPG, TIFF, BMP) for auxiliary pattern design; built-in stitching, exposure dose compensation, and Optical Proximity Correction. |
| Electrical Conditions | 230VAC±5%, 50/60 Hz, 16 A,single-phase |
| Environmental Conditions | Temperature: 21±1°C; Relative Humidity: 40%~60%, non-condensing |
| Compressed Air | 6~9 bar, pressure fluctuation ≤ ±0.5 bar; oil-free, water-free, Class 0 clean compressed air; dew point ≤ -20°C |
| Ambient Lighting | Yellow light environment (wavelength > 500 nm), no UV light leakage |
| Cleanroom Requirement | ISO Class 6 (Class 1000) cleanroom |
| Size(L×W×H)or(D×W×H) | 1320mm×1320mm×2000mm |
| Weight | 1100kg |