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405nm

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Digital Projection Maskless Lithography System SA-UVD

In stock

SKU: SA-UVD
Wavelength
Direct-write Resolution500nm
Writing Speed10 mm2/min
Maximum Substrate Size8-inch
Substrate Thickness0.1 mm ~ 8 mm
Maximum Exposure Area200 mm × 200 mm
Grayscale Level256, 1024, 2048, 4096
Auto-focusing Range70 μm
Objective Lens5×, 10×, 20×, 50×
Writing & Slicing SoftwareSupports multiple formats including JPG, TIFF, and GDS.
Scripted Writing ModeProvides a scripted programming interface to support user-defined processing structures.
Online Drawing Processing ModeSupports real-time online drawing; allows direct drawing of custom graphics on the live sample image.
Real-time Auto-focusingOptical focusing
Electrical Conditions230VAC±5%, 50/60 Hz, 10 A
Environmental ConditionsTemperature: 21±1°C;Relative Humidity: 40%~60%, non-condensing
Compressed Air6~9 bar, tolerance±0.5 bar
Ambient LightingYellow light
Cleanliness LevelClass 1000 cleanroom
Size(L×W×H)or(D×W×H)940mm×850mm×1470mm
Weight250kg
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Tomographic Volumetric Bioprinting System SA-VOP

In stock

SKU: SA-VOP
Wavelength
Maximum Processing Sizeø40 mm×120 mm
Feature Accuracy200 μm
Processing Speed15 s~5 min/piece
Projection Resolution4K (3840×2160)
Projection Accuracy35 µm
Working Distance188 mm~221 mm
Optical Power Density64.4 mW/cm2
Maximum Rotation Speed200 r/min
Minimum Step Angle0.02°
Angular Transmission Accuracy2 arcmin (0.033°)
Repeat Positioning Accuracy±15 arcsec (0.004°)
Allowable Axial Load4000 N
XYZ Triaxial Stroke350 mm×350 mm×100 mm
XYZ Triaxial Positioning Accuracy0.1 mm
Resolution2448×2048
Pixel Size3.45 µm
Maximum Frame Rate60.0 fps
Processing Structure TypeArbitrary 3D and 2.5D structures
Applicable Consumables405 nm-responsive photocurable materials (hydrogel, GelMA, engineering resin, photocurable glass, etc.)
Other FunctionsRefractive index matching, automatic rotation axis alignment, real-time printing monitoring, automatic material assembly, etc.
Size(L×W×H)or(D×W×H)600mm×800mm×600mm
Hot

Ultraviolet Laser Direct-Write Lithography System SA-AOD-M1000

In stock

SKU: SA-AOD-M1000
Wavelength
Minimum Feature Size300nm
Overlay Accuracy300nm
Focusing Range100 μm
Long-term Power stability±1%
Maximum Supported Substrate Size8-inch standard wafer, 200 mm × 200 mm planar substrate
Supported Substrate Thickness0.1 mm ~ 15 mm
Maximum Exposure Area200 mm × 200 mm
Temperature Control Stability±0.1°C (core optical cavity constant temperature control)
Exposure Grayscale Level4096 levels, wi th high-precision exposure dose closed-loop control
UV Special Objective LensOptional magnification: 5×, 10×, 20×, 50×, 100×; flat-field apochromatic design for UV band; core numerical aperture (NA) fully matches the resolution requirements of each magnification.
Pattern Writing Layout Data Preprocessing SoftwareSupports industry-standard vector layout formats including GDSII and OASIS; provides compatible conversion and preprocessing for bitmap formats (JPG, TIFF, BMP) for auxiliary pattern design; built-in stitching, exposure dose compensation, and Optical Proximity Correction.
Electrical Conditions230VAC±5%, 50/60 Hz, 16 A,single-phase
Environmental ConditionsTemperature: 21±1°C; Relative Humidity: 40%~60%, non-condensing
Compressed Air6~9 bar, pressure fluctuation ≤ ±0.5 bar; oil-free, water-free, Class 0 clean compressed air; dew point ≤ -20°C
Ambient LightingYellow light environment (wavelength > 500 nm), no UV light leakage
Cleanroom RequirementISO Class 6 (Class 1000) cleanroom
Size(L×W×H)or(D×W×H)1320mm×1320mm×2000mm
Weight1100kg