Ā Ā Ā Ā Ā Ā SA-SDM-48LS is made of durable stainless steel with flexible operation modes. Equipped with robotic arms, it ensures consistent processing quality. It adopts nitrogen aeration and tank lifting to boost treatment efficiency. Built-in fire and static protection enhance safety. The automatic liquid supply system reduces labor input, fully complying with semiconductor production requirements.Ā
Feature
|
Application
|
Specificationsļ¼
|
Parameter |
Descriptions |
|---|---|
|
Wafer Size |
4″~6″ |
|
Cleaning Capacity |
25pieces2baskets or 4baskets/batch |
|
Feature |
Application |
|---|---|
|
|
Features
| Wafer Size | 4″~6″ |
|---|
General
| Cleaning Capacity | 25pieces2baskets or 4baskets/batch |
|---|
In stock
| Number of Cathodes(max.) | 2 |
|---|---|
| Sputtering Power Supply | DC / RF / pulsed DC, freely switchable |
| Ion Source | Anode & Kaufman & RF ion source |
| Bias | RF / pulsed DC |
| Vacuum Sampling Chamber | Fully-automatic sampling chamber, optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | Ā±3% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | 1000āÆmmĆ1000āÆmm |
| Ultimate Vacuum | 3E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge + āCapacitance diaphragm gauge |
| Temperature Range | RT~300ā |
| Size(LĆWĆH) | 5mĆ2.8mĆ1.6m |
In stock
| Number of Crucibles(max.) | 8 |
|---|---|
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | RF & Kaufman & Hall ion source |
| Fixture types | Dome & Knudsen & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | 12ĆĆ200āÆmm |
| Ultimate Vacuum | 2E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~200ā |
| Size(LĆWĆH) | 8.5mĆ5.5mĆ3.3m |
In stock
| Power Supply(max.) | 8kW |
|---|---|
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45Ā°~45Ā°ļ¼adjustable |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Hall ion source |
| Fixture types | Dome & Knudsen & Plate |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±3% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć200āÆmm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | -50~500ā |
| Size(LĆWĆH) | 3.15mĆ2.4mĆ2.2m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | AlScN, SiC, SiO2, SiN, Polymer |
| Processes | SiC trench/SiC Via/Sic Mark |
| SRF Frequency | 2MHz |
| SRF Power | 2500W |
| SRF Coil | ICP Cubic |
| BRF Frequency | 13.56MHz |
| BRF Power | 1500W |
| Wall | RT~80ā(Adjustable) |
| Upper Electrode | RT~120ā(Adjustable) |
| Bottom Electrode | Clamp chuck:-20~300ā(Max400ā),E chuck:-20~90ā |
| Wafer Clampage | ESC/Mechanical damp |
| Turbo Pump | BOC,2650L/s |
| Injection | TOP,Center |
| MFC | 8 gas/12 gas |
| EPD | OES/LEP&CCD |
| Surface Treatment | Roughness coating |
| Open Method | Electrical |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Process | FOX/STI Anneal/Pad-Oxide/Gate Oxide/BPSG Reflow/Final Alloy/Cu Anneal/N2 Anneal/Polyimide Cure |
| Compatible Materials | Si, SiC, GaN |
| Teamperature Control Accuracy | ā¤Ā±1ā |
| Flat Zone Length | 860mm |
| Batch Size | 150/125 |
| SMIF/Open Cassette/OHT | Option |
| N2 Load Lock | Option |
| AGC | Option |
| Particle Control | ā¤20@0.16Ī¼m |
| Uniformity(WIW/WTW/LTL) | ā¤2%/1.5%/1.5% |
| Metal Contamination (ICP-MS/TXRF) | 5E10 |
| Loccalization Progress | Continuous improvement |
| Size(LĆWĆH) | 4420mmĆ900mmĆ3302mm, 4093mmĆ900mmĆ3302mm |
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