Ā Ā Ā Ā Ā Ā SA-VKE800D is a multi-purpose electron beam evaporation platform built for universal application. It combines outstanding performance, consistent stable running, full automatic control and low maintenance costs, fully accommodating varied e-beam evaporation workflows in industrial manufacturing and academic R&D.Ā
SA-VKE800D is a multi-purpose electron beam evaporation platform built for universal application. It combines outstanding performance, consistent stable running, full automatic control and low maintenance costs, fully accommodating varied e-beam evaporation workflows in industrial manufacturing and academic R&D.
|
Feature |
Application |
|---|---|
|
|
Principleļ¼
Features
| Number of Crucibles(max.) | 6 |
|---|---|
| Uniform Deposition Area(max.) | Ć300āÆmm |
| Ultimate Vacuum | 1E-5Pa |
General
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
|---|---|
| Workpiece Angle | -45Ā°~45Ā°ļ¼adjustable |
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Kaufman & Hall ion source |
| Fixture types | Dome & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~500ā |
| Size(LĆWĆH) | 4.0mĆ3.1mĆ2.9m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | Dielectric SiO2, Dielectric SiNx, Dielectric SiON |
| Processes | FEOL/BEOL(HM/CT/Spacer/Via/PAD) |
| SHD | Si(SDH), Al-Y2O3 coating(SDL) |
| Gas Injection | Dual zone inject(10-90% adj) |
| Temp Control | Chiller |
| Cathode | Dual zone ESC |
| Process Mode | Clean Mode(SDL) |
| Etch Rate(ER) | > 4500 A/min(SDH), >6000 A/min(SDL) |
| Sidewall Roughness | < 1 nm(SDH) |
| U% | WIW < 3% @ EE3mm, WTW < 3% |
| WPH | ~ 10 @15K(SDH), 12 @10K(SDL) |
| COC | 1 |
| MTTR | <1h(SDH) |
| MTBC | > 200 RFh(SDH), > 150 RFh(SDL) |
| Size(LĆWĆH) | 3279mmĆ3253mmĆ2339mm |
In stock
| Processing Position | Patterned material modification and waveguide structures |
|---|---|
| Wavelength | 1030nm, 515nm |
| Objective Lens | 50Ć/20Ć |
| Illumination | Reflection & Transmission |
| Functional Configuration | External energy adjustment, 2D motorized slit |
| Optional | Spatial Light Modulator (SLM), auto-focus tracking |
| Adjustment Stage | Manual |
| Travel Range of Motion Stage | 200āÆmm Ć 200āÆmm |
| Fixture & Workstation | Large-area transparent adsorption stage |
In stock
| Processing Position | Various fiber grating types |
|---|---|
| Wavelength | 1030nm, 515nm |
| Objective Lens | 60Ć/20Ć |
| Illumination | Reflection & Transmission |
| Functional Configuration | External energy adjustment, 2D motorized slit |
| Optional | Spatial Light Modulator (SLM), galvanometer scanner |
| Adjustment Stage | Motorized |
| Travel Range of Motion Stage | 100āÆmm Ć 100āÆmm |
| Fixture & Workstation | Fiber rotary fixture, oil reservoir, processing station for sheetāshaped materials |
| Automatic fiber winding | Partial-function automatic fiber winding |
In stock
| Number of Cathodes(max.) | 4 |
|---|---|
| Sputtering Power Supply | DC / RF / pulsed DC, freely switchable |
| Ion Source | RF & Kaufman & Hall ion source |
| Bias | RF / pulsed DC |
| Vacuum Sampling Chamber | optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | Ā±3% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć150āÆmm |
| Vacuum Measurement | Full-range vacuum gauge + āCapacitance diaphragm gauge |
| Ultimate Vacuum | 1E-5Pa |
| Temperature Range | RT~300ā |
| Size(LĆWĆH) | 1.6mĆ2.75mĆ1.8m |
In stock
| Number of Cathodes(max.) | 5 |
|---|---|
| Sputtering Power Supply | DC / RF / pulsed DC, freely switchable |
| Bias | RF / pulsed DC |
| Vacuum Sampling Chamber | Single-wafer / multi-wafer fully-automatic sampling chamber, optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć300āÆmm |
| Ultimate Vacuum | 8E-6Pa |
| Vacuum Measurement | Full-range vacuum gauge + āCapacitance diaphragm gauge |
| Temperature Range | -50~800ā |
| Size(LĆWĆH) | 3.2mĆ3.3mĆ2.2m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | SiC, SiO2, SiN, Polymer, AlScN |
| Processes | SiC trench/SiC Via/SiC Mark |
| Source-RF | Dual coil,13.56MHz |
| Source Range | 3000W+3000W |
| Bias-RF | 13.56MHz |
| Top Window | Chiller heating |
| ESC | Dual electrode |
| Turbo | 2650L/s |
| Gas Injector | Symmetric 8 injectors |
| Surface Treatement | Y2O3 Coating |
| Maintain Time | 3h |
| SiC Etch Rate | 6000A/min |
| PA | > 0.2Ī¼m < 30ea |
| MTBC | 200RFH |
| Metal Contamination | Free |
| Size(LĆWĆH) | 3279mmĆ3253mmĆ2339mm |
Reviews
Clear filtersThere are no reviews yet.