Showing all 7 results

Wire Bonders deliver high-precision wire interconnection for semiconductor and optoelectronic packaging. Ensuring reliable bonding strength and stable consistency, they adapt to diverse packaging and mass production scenarios.

Wire Bonders

Automatic Ball Wire Bonder SA-BWB-6000PC

SKU: SA-BWB-6000PC

In stock

Bonding Accuracy±3 μm@3sigma
Bonding StrokeX=60mm,Y=70mm
Length of Wire Bonding≤7mm
Loop Height Accuracy±25.4μm
Loop TypesQ-loop / SQ-loop / BGA-TWS
Spool Diameter50mm(2inches)
Bonding Force0~360g
Bonding Wire TypeGold, Copper, CuPd, Ag, Alloy wire(18~50μm)
Bonding Speed45ms(2mm wire length)
Operating SystemWindows
Optical SystemOption between ×2~×4 and ×1.6~×3.6 times, both with programmable focus
Weight650Kg
Input Voltage220V±10%@50~60Hz
Power2KW
Compressed Air Requirement≥0.35MPa
Size(L×W×H)or(D×W×H)1000mm×1300mm×1700mm

Automatic Ball Wire Bonder SA-BWB-6000Plus

SKU: SA-BWB-6000Plus

In stock

Bonding Accuracy±2 μm@3sigma
Bonding StrokeX=60mm,Y=70mm(LF width ≤80mm)
Length of Wire Bonding≤7mm
Min Bond Pad Pitch45μm
Loop TypesQ-loop / SQ-loop / BGA-TWS
Spool Diameter50mm(2inches)
Wire Bonding Capacity(max.)30,000 wires/panel
Bonding Wire TypeGold wire, copper wire, palladium-coated copper wire, silver wire, alloy wires(18~50μm)
Bonding Speed45ms(2mm wire line)
Operating SystemWindows
Optical SystemOption between ×2~×4 and ×1.6~×3.6 times, both with programmable focus
Weight650Kg
Input Voltage220V±10%@50~60Hz
Power2KW
Compressed Air Requirement≥0.35MPa
Size(L×W×H)or(D×W×H)1000mm×1300mm×1700mm

Automatic Deep Access Wire Bonder SA-DAWB-6000B

SKU: SA-DAWB-6000B

In stock

Bonding Accuracy±3 μm@3sigma
Bonding AreaX-axis: 305 mm, Y-axis: 457 mm, rotation range: 0~180°
Ultrasonic0~4 W precise control with stepped flexible energy output
Loop ControlFully programmable
Cavity Depth12mm(max.)
Bonding Force0~220g
Capillary Length16mm/19mm
Bonding Wire TypeGold wire(18~75μm), copper wire (18~75 μm), selected alloy wires
Bonding Speed≥5wires/s
Operating SystemWindows
Weight1.2T
Input Voltage220V±10%@50~60Hz
Power2KW
Compressed Air Requirement≥0.35MPa
Size(L×W×H)or(D×W×H)1500mm×1000mm×1700mm
Hot

Automatic Deep Access Wire Bonder SA-DAWB-6000W

SKU: SA-DAWB-6000W

In stock

Bonding Accuracy±3 μm@3sigma
Bonding AreaX-axis: 305 mm, Y-axis: 457 mm, rotation range: ±220°
Ultrasonic0~4 W precise control with stepped flexible energy output
Loop ControlFully programmable
Cavity Depth16mm(max.)
Bonding Force0~220g
Capillary Length19mm/25mm
Bonding Wire TypeGold wire(18~75μm), aluminum wire (18~75 μm), gold ribbon (12.7×50 μm ~ 25.4×300 μm), partial alloy wires
Bonding Speed≥5wires/s
Operating SystemWindows
Weight1.2T
Input Voltage220V±10%@50~60Hz
Power2KW
Compressed Air Requirement≥0.35MPa
Size(L×W×H)or(D×W×H)1500mm×1000mm×1700mm

Multifunctional Manual Wire Bonder SA-MMWB-450B

SKU: SA-MMWB-450B

In stock

Bonding Wire TypeAu(15~75μm),Pt(18~25μm),Ag(18~50μm)
Cavity Depth12mm(max.)
Capillary Length16mm/19mm
Spool Diameter1/2inch(standard), 2inches(optional)
Bonding Force1~250g
Bond PowerNumerical control,1000x subdivision
Clamping TableMaximum Temperature 200℃
Bond Head Z Range18mm
Bond Head X-Y RangeX=15mm,Y=15mm
Lifting Table Z Range0~18mm
Weight47kg(GW.), 70kg(NW.)
Input Voltage220V±10%@50~60Hz
Power Consumption≤500W
Size(L×W×H)or(D×W×H)640mm×620mm×450mm
Hot

Multifunctional Manual Wire Bonder SA-MMWB-450PB

SKU: SA-MMWB-450PB

In stock

Bonding Wire TypeAu(15~75μm),Pt(18~25μm), Cu(18~50μm),Ag(18~50μm)
Cavity Depth15mm(max.)
Capillary Length16mm/19mm
Spool Diameter1/2inch(standard), 2inches(optional)
Bonding Force1~250g
Bond PowerNumerical control,1000x subdivision
Clamping TableMaximum Temperature 200℃
Bond Head Z Range18mm
Bond Head X-Y RangeX=15mm,Y=15mm
Lifting Table Z Range0~18mm
Weight47kg(GW.), 70kg(NW.)
Input Voltage220V±10%@50~60Hz
Power Consumption≤500W
Size(L×W×H)or(D×W×H)640mm×620mm×450mm

Multifunctional Manual Wire Bonder SA-MMWB-450PW

SKU: SA-MMWB-450PW

In stock

Bonding Wire TypeAl(18~100μm),Au(15~75μm), Gold Ribbon(12.7 × 50μm~25.4 × 300μm),specific alloy wire
Cavity Depth21mm(max.)
Capillary Length19mm/25mm
Spool Diameter1/2inch(standard), 2inches(optional)
Bonding Force1~250g
Bond PowerNumerical control,1000x subdivision
Clamping TableMaximum Temperature 200℃
Bond Head Z Range18mm
Bond Head X-Y RangeX=15mm,Y=15mm
Lifting Table Z Range0~18mm
Weight47kg(GW.), 70kg(NW.)
Input Voltage220V±10%@50~60Hz
Power Consumption≤500W
Size(L×W×H)or(D×W×H)640mm×620mm×450mm