General PVD System SA-Polaris BM620
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Fully automated, high-performance PECVD equipment SA-EPEE i200
Fully automated, high-performance PECVD equipment SA-EPEE i200 Call for Price
General PVD System SA-eVictor AX20P - Image 1
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General PVD System SA-eVictor AX20P
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General PVD System SA-eVictor AX20P

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SKU: SA-eVictor AX20P

Ā Ā Ā Ā Ā Ā SA-eVictor AX20P is a cluster-type 6/8-inch front-side PVD system dedicated to Si/SiC power devices and advanced logic chips. It realizes sputtering deposition of Ti, TiN, AlCu, NiV and Ag for ohmic contact, barrier layer and pad metallization. With strict film uniformity below 3% and particle count under 30ea@0.3Ī¼m, the equipment has been fully validated for mass production with stable film performance and outstanding cost efficiency.Ā 

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Description

Datasheet

SA-eVictor AX20P is a cluster-type 6/8-inch front-side PVD system dedicated to Si/SiC power devices and advanced logic chips. It realizes sputtering deposition of Ti, TiN, AlCu, NiV and Ag for ohmic contact, barrier layer and pad metallization. With strict film uniformity below 3% and particle count under 30ea@0.3Ī¼m, the equipment has been fully validated for mass production with stable film performance and outstanding cost efficiency.

Feature

Application
  • Cluster multi-chamber architecture
  • Low particle contamination
  • Mass production
  • Compatible with sputtering
  • Si/SiC Power
  • Ohmic Contact
  • Barrier Layer
  • Planarization

Principleļ¼š

3200Ɨ2700Ɨ2200 mm

3100Ɨ4400Ɨ2200 mm

Applicationļ¼š

Specification

Features

Wafer Size6″, 8″

General

THK mean(A)1000Ā±50(Ni), 600Ā±30(Ti), 1000Ā±50(TiN), 40KĀ±2K(Al)
Rs Mean(Ī©/ā–”)1Ā±0.02(Ni), 11Ā±1.0(Ti), 16Ā±3.0(TiN), 0.75Ā±0.05(Al)
Rs U%(WIW,%,16)< 3%
Infilm Particle< 30ea@0.3Ī¼m
Size(LƗWƗH)2700mmƗ3200mmƗ2200mm, 4400mmƗ3100mmƗ2200mm

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