SA-VKE360 is a space-saving evaporation platform integrating electron beam and resistance thermal evaporation technologies. It features complete process functions, full automatic operation and low maintenance workload, catering to academic R&D experiments and small-volume pilot production.
SA-VKE360 is a space-saving evaporation platform integrating electron beam and resistance thermal evaporation technologies. It features complete process functions, full automatic operation and low maintenance workload, catering to academic R&D experiments and small-volume pilot production.
|
Feature |
Application |
|---|---|
|
|
Principle：
Features
| Uniform Deposition Area(max.) | Ø200 mm |
|---|---|
| Ultimate Vacuum | 1E-5Pa |
General
| Number of Crucibles(max.) | 6 |
|---|---|
| Power Supply(max.) | 10kW |
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45°~45°，adjustable |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Hall ion source |
| Fixture types | Dome & Plate |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±3% |
| Coating Repeatability | ±2% |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | -50~300℃ |
| Size(L×W×H)or(D×W×H) | 3.15m×2.4m×2.2m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | Dielectric SiNx, Dielectric SiO2, Dielectric SiON |
| Processes | FEOL/BEOL(HM/CT/Spacer/Via/PAD) |
| SHD | Si(SDH), Al-Y2O3 coating(SDL) |
| Gas Injection | Dual zone inject(10-90% adj) |
| Temp Control | Chiller |
| Cathode | Dual zone ESC |
| Process Mode | Clean Mode(SDL) |
| Etch Rate(ER) | > 4500 A/min(SDH), >6000 A/min(SDL) |
| Sidewall Roughness | < 1 nm(SDH) |
| U% | WIW < 3% @ EE3mm, WTW < 3% |
| WPH | ~ 10 @15K(SDH), 12 @10K(SDL) |
| COC | 1 |
| MTTR | <1h(SDH) |
| MTBC | > 200 RFh(SDH), > 150 RFh(SDL) |
| Size(L×W×H)or(D×W×H) | 3279mm×3253mm×2339mm |
In stock
| Number of Crucibles(max.) | 4 |
|---|---|
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | RF & Kaufman & Hall ion source |
| Fixture types | Dome & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø960 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~300℃ |
| Size(L×W×H)or(D×W×H) | 4.4m×4.1m×2.6m |
In stock
| Number of Crucibles(max.) | 8 |
|---|---|
| Power Supply(max.) | 10kW |
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | RF & Kaufman & Hall ion source |
| Fixture types | Dome & Knudsen & Planetary &Plate |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±3% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø300 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~300℃ |
| Size(L×W×H)or(D×W×H) | 3.35m×2.8m×2.2m |
In stock
| Processing Position | Patterned material modification and waveguide structures |
|---|---|
| Wavelength | 1030nm, 515nm |
| Objective Lens | 50×/20× |
| Illumination | Reflection & Transmission |
| Functional Configuration | External energy adjustment, 2D motorized slit |
| Optional | Spatial Light Modulator (SLM), auto-focus tracking |
| Adjustment Stage | Manual |
| Travel Range of Motion Stage | 200 mm × 200 mm |
| Fixture & Workstation | Large-area transparent adsorption stage |
In stock
| Process Chamber Type | Sputter & Degas & Pre-clean & Evaporation |
|---|---|
| Autosampling Chamber | Integrated with BROOKS system |
| Ion Source | optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø200 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge + Capacitance diaphragm gauge |
| Temperature Range | -80~500℃ |
| Size(L×W×H)or(D×W×H) | 3.73m×2.75m×2.2m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Process | FOX/STI Anneal/Pad-Oxide/Gate Oxide/BPSG Reflow/Final Alloy/Cu Anneal/N2 Anneal/Polyimide Cure |
| Compatible Materials | GaN, Si, SiC |
| Teamperature Control Accuracy | ≤±1℃ |
| Flat Zone Length | 860mm |
| Batch Size | 150/125 |
| SMIF/Open Cassette/OHT | Option |
| N2 Load Lock | Option |
| AGC | Option |
| Particle Control | ≤20@0.16μm |
| Uniformity(WIW/WTW/LTL) | ≤2%/1.5%/1.5% |
| Metal Contamination (ICP-MS/TXRF) | 5E10 |
| Loccalization Progress | Continuous improvement |
| Size(L×W×H)or(D×W×H) | 4093mm×900mm×3302mm, 4420mm×900mm×3302mm |
Reviews
Clear filtersThere are no reviews yet.