SiC Etcher SA-GDE C200L
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Metal Etcher SA-NMC508SEM
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Dielectric Etcher SA-NMC508SDH/SDL - Image 1
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Dielectric Etcher SA-NMC508SDH/SDL
Dielectric Etcher SA-NMC508SDH/SDL - Image 2

Dielectric Etcher SA-NMC508SDH/SDL

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SKU: SA-NMC508SDH/SDL

Ā Ā Ā Ā Ā Ā SA-NMC508SDH/SDL are mature 6/8-inch dielectric etchers for logic, SiC power and MEMS manufacturing, processing SiO2 and SiNx for FEOL and BEOL steps. Featuring adjustable dual-zone gas injection and dual-zone ESC, the tools realize excellent wafer uniformity. SDL boasts higher etch rate while SDH cuts ownership cost, both with long MTBC and stable mass-production capability.Ā 

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Description

Datasheet
SA-NMC508SDH/SDL are mature 6/8-inch dielectric etchers for logic, SiC power and MEMS manufacturing, processing SiO2 and SiNx for FEOL and BEOL steps. Featuring adjustable dual-zone gas injection and dual-zone ESC, the tools realize excellent wafer uniformity. SDL boasts higher etch rate while SDH cuts ownership cost, both with long MTBC and stable mass-production capability.

Feature

Application
  • Better Temp U%
  • Clean Mode
  • High Precision Control
  • Better Roughness
  • Short Maintenance Time
  • Logic
  • Power
  • Si/SiC
  • MEMS
  • GaN

Principleļ¼š

Specification

Features

Wafer Size6″, 8″
Etching MaterialsDielectric SiO2, Dielectric SiNx, Dielectric SiON

General

ProcessesFEOL/BEOL(HM/CT/Spacer/Via/PAD)
SHDSi(SDH), Al-Y2O3 coating(SDL)
Gas InjectionDual zone inject(10-90% adj)
Temp ControlChiller
CathodeDual zone ESC
Process ModeClean Mode(SDL)
Etch Rate(ER)> 4500 A/min(SDH), >6000 A/min(SDL)
Sidewall Roughness< 1 nm(SDH)
U%WIW < 3% @ EE3mm, WTW < 3%
WPH~ 10 @15K(SDH), 12 @10K(SDL)
COC1
MTTR<1h(SDH)
MTBC> 200 RFh(SDH), > 150 RFh(SDL)
Size(LƗWƗH)3279mmƗ3253mmƗ2339mm

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