SA-VKE800D is a multi-purpose electron beam evaporation platform built for universal application. It combines outstanding performance, consistent stable running, full automatic control and low maintenance costs, fully accommodating varied e-beam evaporation workflows in industrial manufacturing and academic R&D.
SA-VKE800D is a multi-purpose electron beam evaporation platform built for universal application. It combines outstanding performance, consistent stable running, full automatic control and low maintenance costs, fully accommodating varied e-beam evaporation workflows in industrial manufacturing and academic R&D.
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Feature |
Application |
|---|---|
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Principle：
Features
| Uniform Deposition Area(max.) | Ø300 mm |
|---|---|
| Ultimate Vacuum | 1E-5Pa |
General
| Number of Crucibles(max.) | 6 |
|---|---|
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45°~45°，adjustable |
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Kaufman & Hall ion source |
| Fixture types | Dome & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~500℃ |
| Size(L×W×H)or(D×W×H) | 4.0m×3.1m×2.9m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | Dielectric SiNx, Dielectric SiO2, Dielectric SiON |
| Processes | FEOL/BEOL(HM/CT/Spacer/Via/PAD) |
| SHD | Si(SDH), Al-Y2O3 coating(SDL) |
| Gas Injection | Dual zone inject(10-90% adj) |
| Temp Control | Chiller |
| Cathode | Dual zone ESC |
| Process Mode | Clean Mode(SDL) |
| Etch Rate(ER) | > 4500 A/min(SDH), >6000 A/min(SDL) |
| Sidewall Roughness | < 1 nm(SDH) |
| U% | WIW < 3% @ EE3mm, WTW < 3% |
| WPH | ~ 10 @15K(SDH), 12 @10K(SDL) |
| COC | 1 |
| MTTR | <1h(SDH) |
| MTBC | > 200 RFh(SDH), > 150 RFh(SDL) |
| Size(L×W×H)or(D×W×H) | 3279mm×3253mm×2339mm |
In stock
| Number of Crucibles(max.) | 6 |
|---|---|
| Power Supply(max.) | 10kW |
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45°~45°，adjustable |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Hall ion source |
| Fixture types | Dome & Plate |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±3% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø200 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | -50~300℃ |
| Size(L×W×H)or(D×W×H) | 3.15m×2.4m×2.2m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Standard Configuration | SMIF×3+EFEM×1+LL×2+TM×1+PM×3 |
| Wafer Station | Twins chamber, 2 pcs/chamber, max 6pcs for 3 chambers |
| Automation | Open cassette/SMIF |
| Process | SiO2/SiNx/TEOS/BPSG |
| Deposit Materials | BPSG, SiNx, SiO2, SiON, TEOS SiO2 |
| Uniformity | WIW ≤3.0%、WTW≤3.0%、RTR≤3.0% |
| Gas Configuration | TEOS/TEPO/TEB/O2/SiH4/NH3/N2O/He/N2/NF3/Ar(RPS) |
| Cooling Module | EFFM cooling buffer |
| Foot print | 2100×3360(7.0m2) |
| WPH(relative) | 1.20 |
| CoC(relative) | 0.83 |
| CoO(relative) | 0.75 |
| Clean Mode | RPS clean,>2μm/min |
| Size(L×W×H)or(D×W×H) | 2100mm×3360mm×2600mm |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | PolySi, Si |
| Processes | Poly EB/STI/Poly gate/CT Si |
| Coil | Dual Zone |
| Match Mode | L-Match |
| Magnetic Shield | Yes |
| Gas Injector | Dual Zone |
| FRC | Yes |
| Liner | Symmetric Grid |
| Edge Ring | CIP version |
| ESC | Dual Zone |
| ESC Materials | Ceramic |
| Lift Pin | Ceramic |
| Turbo | 1600L/s |
| Chamber | Symmetric |
| Size(L×W×H)or(D×W×H) | 3279mm×3253mm×2339mm |
In stock
| Number of Cathodes(max.) | 2 |
|---|---|
| Sputtering Power Supply | DC / RF / pulsed DC, freely switchable |
| Ion Source | RF & Kaufman & Hall ion source |
| Bias | RF / pulsed DC |
| Vacuum Sampling Chamber | Single-wafer/multi-wafer fully-automatic sampling chamber, optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø200 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge + Capacitance diaphragm gauge |
| Temperature Range | -50~800℃ |
| Size(L×W×H)or(D×W×H) | 3.8m×2.8m×2.2m |
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