Femtosecond Laser Micro-Nano Multi-Functional Processing Equipment for Fiber Bragg Gratings SA-FSD-1000M
Femtosecond Laser Micro-Nano Multi-Functional Processing Equipment for Fiber Bragg Gratings SA-FSD-1000M Call for Price
Back to products
Automatic Deep Access Wire Bonder SA-DAWB-6000B
Automatic Deep Access Wire Bonder SA-DAWB-6000B Call for Price
Hot
Femtosecond Laser Micro-Nano Automatic Processing Equipment for Fiber Bragg Gratings SA-FSD-1000IR - Image 1
Click to enlarge

Femtosecond Laser Micro-Nano Automatic Processing Equipment for Fiber Bragg Gratings SA-FSD-1000IR

17 People watching this product now!
SKU: SA-FSD-1000IR

    SA-FSD-1000IR Femtosecond Laser Automatic Micro-Nano Processing Equipment is engineered for industrial mass production. Equipped with a fiber reel-based continuous feeding mechanism and a machine vision automatic alignment system, it enables high-precision femtosecond laser processing for kilometer-length optical fibers.

Call for Price

(Price on request)

Compare
Add to wishlist

Description

Datasheet

    SA-FSD-1000IR Femtosecond Laser Automatic Micro-Nano Processing Equipment is engineered for industrial mass production. Equipped with a fiber reel-based continuous feeding mechanism and a machine vision automatic alignment system, it enables high-precision femtosecond laser processing for kilometer-length optical fibers.

Feature

Application
  • Femtosecond processing
  • Micro-holes and micro-grooves
  • Material modification
  • High-consistency processing
  • Low-loss waveguide fabrication
  • Waveguide end-face profile control
  • Arbitrary 3D modulation
  • Fabrication of multiple grating types

Fabrication Parameters for Fiber Gratings：

Reflectivity

Descriptions

Reflectivity

0.01%-90%,adjustable

Side-Mode Suppression Ratio (SMSR)

>18dB

Typical Bandwidth-3dB

≤0.25 nm

Central Wavelength Deviation

≤±0.15 nm

Software & Processing Capabilities:
1.Support two processing modes: constant-speed processing and pulse-position triggered processing.
2.Support grating types include: conventional single‑wavelength gratings, apodized gratings, metagratings, chirped gratings, phase-shifted gratings, etc.
3.Support script-programmed processing, enabling machining of complex fiber arrays via programmable control of the fiber winding machine.

Specification

Features

Wavelength

General

Processing PositionMass production of typical fiber gratings Kilometer-length fiber processing
Objective Lens60×
IlluminationTransmission
Functional ConfigurationExternal energy adjustment
OptionalSpatial Light Modulator (SLM), 2D motorized slit
Adjustment StageMotorized
Travel Range of Motion Stage100 mm × 100 mm
Fixture & WorkstationAutomatic fixture for fiber grating fabrication
Automatic fiber windingFull-function automatic fiber winding

Customer Reviews

0 reviews
0
0
0
0
0

Reviews

Clear filters

There are no reviews yet.

Be the first to review “Femtosecond Laser Micro-Nano Automatic Processing Equipment for Fiber Bragg Gratings SA-FSD-1000IR”

Your email address will not be published. Required fields are marked *

1 2 3 4 5
1 2 3 4 5
1 2 3 4 5

Related Products
Compare
Quick view
Add to wishlist

Electron Beam Evaporation System SA-VKE360

, ,

In stock

Call for Price
Read more
SKU: SA-VKE360
Number of Crucibles(max.)6
Power Supply(max.)10kW
Automatic LoadlocksSingle &multi-chip automatic laodlock
Workpiece Angle-45°~45°，adjustable
Film thickness monitoringCrystal oscillator controller
Ion SourceHall ion source
Fixture typesDome & Plate
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity±3%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ø200 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge
Temperature Range-50~300℃
Size(L×W×H)3.15m×2.4m×2.2m
Hot
Compare
Quick view
Add to wishlist

Femtosecond Laser 3D Micro-Nano Processing Equipment for Hard-and-Brittle Materials SA-FSD-500

, ,

In stock

Call for Price
Read more
SKU: SA-FSD-500
Processing PositionPatterned material modification and waveguide structures
Wavelength
Objective Lens50×/20×
IlluminationReflection & Transmission
Functional ConfigurationExternal energy adjustment, 2D motorized slit
OptionalSpatial Light Modulator (SLM), auto-focus tracking
Adjustment StageManual
Travel Range of Motion Stage200 mm × 200 mm
Fixture & WorkstationLarge-area transparent adsorption stage
Compare
Quick view
Add to wishlist

Indium Evaporation System SA-VKT550I

, ,

In stock

Call for Price
Read more
SKU: SA-VKT550I
Power Supply(max.)8kW
Workpiece Angle-45°~45°，adjustable
Film thickness monitoringCrystal oscillator controller
Ion SourceKaufman & Hall ion source
Fixture typesDome & Knudsen & Plate
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity±3%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ø300 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge
Temperature Range-80~200℃
Size(L×W×H)3.3m×2.7m×2.2m
Compare
Quick view
Add to wishlist

Magnetron Sputter System SA-VKM800

, ,

In stock

Call for Price
Read more
SKU: SA-VKM800
Number of Cathodes(max.)4
Sputtering Power SupplyDC / RF / pulsed DC, freely switchable
Ion SourceRF & Kaufman & Hall ion source
BiasRF / pulsed DC
Vacuum Sampling ChamberMulti-wafer fully-automatic sampling chamber, optional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±1.5%
Coating Repeatability±2%
Uniform Deposition Area(max.)5×Ø300 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge + ‌Capacitance diaphragm gauge
Temperature Range-50~800℃
Size(L×W×H)3.2m×3.3m×2.2m
Compare
Quick view
Add to wishlist

Poly-Si Etcher SA-NMC508SES

, ,

In stock

Call for Price
Read more
SKU: SA-NMC508SES
Wafer Size6″, 8″
Etching MaterialsSi, PolySi
ProcessesPoly EB/STI/Poly gate/CT Si
CoilDual Zone
Match ModeL-Match
Magnetic ShieldYes
Gas InjectorDual Zone
FRCYes
LinerSymmetric Grid
Edge RingCIP version
ESCDual Zone
ESC MaterialsCeramic
Lift PinCeramic
Turbo1600L/s
ChamberSymmetric
Size(L×W×H)3279mm×3253mm×2339mm
Compare
Quick view
Add to wishlist

SiC Etcher SA-GDE C200L

, ,

In stock

Call for Price
Read more
SKU: SA-GDE C200L
Wafer Size6″, 8″
Etching MaterialsSiC, SiO2, SiN, Polymer, AlScN
ProcessesSiC trench/SiC Via/Sic Mark
SRF Frequency2MHz
SRF Power2500W
SRF CoilICP Cubic
BRF Frequency13.56MHz
BRF Power1500W
WallRT~80℃(Adjustable)
Upper ElectrodeRT~120℃(Adjustable)
Bottom ElectrodeClamp chuck:-20~300℃(Max400℃),E chuck:-20~90℃
Wafer ClampageESC/Mechanical damp
Turbo PumpBOC,2650L/s
InjectionTOP,Center
MFC8 gas/12 gas
EPDOES/LEP&CCD
Surface TreatmentRoughness coating
Open MethodElectrical