SA-VKT550I is a custom-built thermal resistance evaporation platform, specially optimized for ultra-precise indium bump formation. Boasting consistent reliable output, comprehensive automated operation and low upkeep costs, it fully satisfies stringent process standards for advanced flip-chip interconnection and bonding.
|
Feature |
Application |
|---|---|
|
|
Principleļ¼

Reviews
Clear filtersThere are no reviews yet.