SA-VKT360 is a space-saving evaporation platform integrating electron beam and resistance thermal evaporation technologies. It features complete process functions, full automatic operation and low maintenance workload, catering to academic R&D experiments and small-volume pilot production.
SA-VKT360 is a space-saving evaporation platform integrating electron beam and resistance thermal evaporation technologies. It features complete process functions, full automatic operation and low maintenance workload, catering to academic R&D experiments and small-volume pilot production.
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Feature |
Application |
|---|---|
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Principle：
Features
| Uniform Deposition Area(max.) | Ø200 mm |
|---|---|
| Ultimate Vacuum | 1E-5Pa |
General
| Power Supply(max.) | 8kW |
|---|---|
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45°~45°，adjustable |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Hall ion source |
| Fixture types | Dome & Knudsen & Plate |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±3% |
| Coating Repeatability | ±2% |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | -50~500℃ |
| Size(L×W×H)or(D×W×H) | 3.15m×2.4m×2.2m |
In stock
| Number of Crucibles(max.) | 8 |
|---|---|
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | RF & Kaufman & Hall ion source |
| Fixture types | Dome & Knudsen & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø300 mm |
| Ultimate Vacuum | 2E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~300℃ |
| Size(L×W×H)or(D×W×H) | 4.05m×3.9m×2.8m |
In stock
| Number of Crucibles(max.) | 6 |
|---|---|
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45°~45°，adjustable |
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Kaufman & Hall ion source |
| Fixture types | Dome &Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø260 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~500℃ |
| Size(L×W×H)or(D×W×H) | 3m×2.5m×2.2m |
In stock
| Number of Crucibles(max.) | 6 |
|---|---|
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45°~45°，adjustable |
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Kaufman & Hall ion source |
| Fixture types | Dome & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø300 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~500℃ |
| Size(L×W×H)or(D×W×H) | 4.0m×3.1m×2.9m |
In stock
| Process Chamber Type | Sputter & Degas & Pre-clean & Evaporation |
|---|---|
| Autosampling Chamber | Integrated with BROOKS system |
| Ion Source | optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | ±2% |
| Coating Repeatability | ±2% |
| Uniform Deposition Area(max.) | Ø200 mm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge + Capacitance diaphragm gauge |
| Temperature Range | -80~500℃ |
| Size(L×W×H)or(D×W×H) | 3.73m×2.75m×2.2m |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | AlScN, Polymer, SiC, SiN, SiO2 |
| Processes | SiC trench/SiC Via/Sic Mark |
| SRF Frequency | 2MHz |
| SRF Power | 2500W |
| SRF Coil | ICP Cubic |
| BRF Frequency | 13.56MHz |
| BRF Power | 1500W |
| Wall | RT~80℃(Adjustable) |
| Upper Electrode | RT~120℃(Adjustable) |
| Bottom Electrode | Clamp chuck:-20~300℃(Max400℃),E chuck:-20~90℃ |
| Wafer Clampage | ESC/Mechanical damp |
| Turbo Pump | BOC,2650L/s |
| Injection | TOP,Center |
| MFC | 8 gas/12 gas |
| EPD | OES/LEP&CCD |
| Surface Treatment | Roughness coating |
| Open Method | Electrical |
In stock
| Wafer Size | 6″, 8″ |
|---|---|
| Process | FOX/STI Anneal/Pad-Oxide/Gate Oxide/BPSG Reflow/Final Alloy/Cu Anneal/N2 Anneal/Polyimide Cure |
| Compatible Materials | GaN, Si, SiC |
| Teamperature Control Accuracy | ≤±1℃ |
| Flat Zone Length | 860mm |
| Batch Size | 150/125 |
| SMIF/Open Cassette/OHT | Option |
| N2 Load Lock | Option |
| AGC | Option |
| Particle Control | ≤20@0.16μm |
| Uniformity(WIW/WTW/LTL) | ≤2%/1.5%/1.5% |
| Metal Contamination (ICP-MS/TXRF) | 5E10 |
| Loccalization Progress | Continuous improvement |
| Size(L×W×H)or(D×W×H) | 4093mm×900mm×3302mm, 4420mm×900mm×3302mm |
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