Showing all 8 results
Packaging solutions cover professional optoelectronic and semiconductor packaging processes. Featuring stable performance and high adaptability, they deliver reliable packaging protection and structural integration for various chip and device products.
Automatic Ball Wire Bonder SA-BWB-6000PC
SKU:
SA-BWB-6000PC
In stock
Login to see prices| Bonding Accuracy | ±3 μm@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm |
| Length of Wire Bonding | ≤7mm |
| Loop Height Accuracy | ±25.4μm |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Bonding Force | 0~360g |
| Bonding Wire Type | Gold, Copper, CuPd, Ag, Alloy wire(18~50μm) |
| Bonding Speed | 45ms(2mm wire length) |
| Operating System | Windows |
| Optical System | Option between ×2~×4 and ×1.6~×3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1000mm×1300mm×1700mm |
Automatic Ball Wire Bonder SA-BWB-6000Plus
SKU:
SA-BWB-6000Plus
In stock
Login to see prices| Bonding Accuracy | ±2 μm@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm(LF width ≤80mm) |
| Length of Wire Bonding | ≤7mm |
| Min Bond Pad Pitch | 45μm |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Wire Bonding Capacity(max.) | 30,000 wires/panel |
| Bonding Wire Type | Gold wire, copper wire, palladium-coated copper wire, silver wire, alloy wires(18~50μm) |
| Bonding Speed | 45ms(2mm wire line) |
| Operating System | Windows |
| Optical System | Option between ×2~×4 and ×1.6~×3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1000mm×1300mm×1700mm |
Automatic Deep Access Wire Bonder SA-DAWB-6000B
SKU:
SA-DAWB-6000B
In stock
Login to see prices| Bonding Accuracy | ±3 μm@3sigma |
|---|---|
| Bonding Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: 0~180° |
| Ultrasonic | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Cavity Depth | 12mm(max.) |
| Bonding Force | 0~220g |
| Capillary Length | 16mm/19mm |
| Bonding Wire Type | Gold wire(18~75μm), copper wire (18~75 μm), selected alloy wires |
| Bonding Speed | ≥5wires/s |
| Operating System | Windows |
| Weight | 1.2T |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1500mm×1000mm×1700mm |
Hot
Automatic Deep Access Wire Bonder SA-DAWB-6000W
SKU:
SA-DAWB-6000W
In stock
Login to see prices| Bonding Accuracy | ±3 μm@3sigma |
|---|---|
| Bonding Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: ±220° |
| Ultrasonic | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Cavity Depth | 16mm(max.) |
| Bonding Force | 0~220g |
| Capillary Length | 19mm/25mm |
| Bonding Wire Type | Gold wire(18~75μm), aluminum wire (18~75 μm), gold ribbon (12.7×50 μm ~ 25.4×300 μm), partial alloy wires |
| Bonding Speed | ≥5wires/s |
| Operating System | Windows |
| Weight | 1.2T |
| Input Voltage | 220V±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ≥0.35MPa |
| Size(L×W×H)or(D×W×H) | 1500mm×1000mm×1700mm |
Multifunctional Manual Wire Bonder SA-MMWB-450B
SKU:
SA-MMWB-450B
In stock
Login to see prices| Bonding Wire Type | Au(15~75μm),Pt(18~25μm),Ag(18~50μm) |
|---|---|
| Cavity Depth | 12mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Size(L×W×H)or(D×W×H) | 640mm×620mm×450mm |
Hot
Multifunctional Manual Wire Bonder SA-MMWB-450PB
SKU:
SA-MMWB-450PB
In stock
Login to see prices| Bonding Wire Type | Au(15~75μm),Pt(18~25μm), Cu(18~50μm),Ag(18~50μm) |
|---|---|
| Cavity Depth | 15mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Size(L×W×H)or(D×W×H) | 640mm×620mm×450mm |
Multifunctional Manual Wire Bonder SA-MMWB-450PW
SKU:
SA-MMWB-450PW
In stock
Login to see prices| Bonding Wire Type | Al(18~100μm),Au(15~75μm), Gold Ribbon(12.7 × 50μm~25.4 × 300μm),specific alloy wire |
|---|---|
| Cavity Depth | 21mm(max.) |
| Capillary Length | 19mm/25mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Size(L×W×H)or(D×W×H) | 640mm×620mm×450mm |
Vacuum Die Bonder SA-WB061
SKU:
SA-WB061
In stock
Login to see prices| Wafer Size | 150mm, 200mm, 300mm |
|---|---|
| Functions | Timing, pressurization, heating(included), vacuum(included), cooling(included) |
| Bond Pressure | 0~3bar (adjustable) |
| Throughput | Depends on the process |
| Chamber Environment | Vacuum Pump included |
| Power Requirements | 220V, 10A |
| Equipment Power | 1KW |
| Size(L×W×H)or(D×W×H) | 650mm×600mm×350mm |
| Weight | 50kg |
| Temperature Range | RT~200℃ |