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Electron Beam Evaporation System SA-VKE500D
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SKU:
SA-VKE500D
| Number of Crucibles(max.) | 6 |
|---|---|
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45Ā°~45Ā°ļ¼adjustable |
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Kaufman & Hall ion source |
| Fixture types | Dome &Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć260āÆmm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~500ā |
| Size(LĆWĆH) | 3mĆ2.5mĆ2.2m |
Electron Beam Evaporation System SA-VKE800D
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SKU:
SA-VKE800D
| Number of Crucibles(max.) | 6 |
|---|---|
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45Ā°~45Ā°ļ¼adjustable |
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Kaufman & Hall ion source |
| Fixture types | Dome & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć300āÆmm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~500ā |
| Size(LĆWĆH) | 4.0mĆ3.1mĆ2.9m |
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Femtosecond Laser 3D Micro-Nano Processing Equipment for Hard-and-Brittle Materials SA-FSD-500
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SKU:
SA-FSD-500
| Processing Position | Patterned material modification and waveguide structures |
|---|---|
| Wavelength | 1030nm, 515nm |
| Objective Lens | 50Ć/20Ć |
| Illumination | Reflection & Transmission |
| Functional Configuration | External energy adjustment, 2D motorized slit |
| Optional | Spatial Light Modulator (SLM), auto-focus tracking |
| Adjustment Stage | Manual |
| Travel Range of Motion Stage | 200āÆmm Ć 200āÆmm |
| Fixture & Workstation | Large-area transparent adsorption stage |
Electron Beam Evaporation System SA-VKE360
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SKU:
SA-VKE360
| Number of Crucibles(max.) | 6 |
|---|---|
| Power Supply(max.) | 10kW |
| Automatic Loadlocks | Single &multi-chip automatic laodlock |
| Workpiece Angle | -45Ā°~45Ā°ļ¼adjustable |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | Hall ion source |
| Fixture types | Dome & Plate |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±3% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć200āÆmm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | -50~300ā |
| Size(LĆWĆH) | 3.15mĆ2.4mĆ2.2m |
Vertical Furnace SA-Flouris X201H/P
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SKU:
SA-Flouris X201H/P
| Wafer Size | 6″, 8″ |
|---|---|
| Process | FOX/STI Anneal/Pad-Oxide/Gate Oxide/BPSG Reflow/Final Alloy/Cu Anneal/N2 Anneal/Polyimide Cure |
| Compatible Materials | Si, SiC, GaN |
| Teamperature Control Accuracy | ā¤Ā±1ā |
| Flat Zone Length | 860mm |
| Batch Size | 150/125 |
| SMIF/Open Cassette/OHT | Option |
| N2 Load Lock | Option |
| AGC | Option |
| Particle Control | ā¤20@0.16Ī¼m |
| Uniformity(WIW/WTW/LTL) | ā¤2%/1.5%/1.5% |
| Metal Contamination (ICP-MS/TXRF) | 5E10 |
| Loccalization Progress | Continuous improvement |
| Size(LĆWĆH) | 4420mmĆ900mmĆ3302mm, 4093mmĆ900mmĆ3302mm |
Electron Beam Evaporation System SA-VKE1100D/E1500D
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SKU:
SA-VKE1100D/E1500D
| Number of Crucibles(max.) | 4 |
|---|---|
| Power Supply(max.) | 10kW |
| Film thickness monitoring | Crystal oscillator controller |
| Ion Source | RF & Kaufman & Hall ion source |
| Fixture types | Dome & Planetary |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć960āÆmm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge |
| Temperature Range | RT~300ā |
| Size(LĆWĆH) | 4.4mĆ4.1mĆ2.6m |
Poly-Si Etcher SA-NMC508SES
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SKU:
SA-NMC508SES
| Wafer Size | 6″, 8″ |
|---|---|
| Etching Materials | Si, PolySi |
| Processes | Poly EB/STI/Poly gate/CT Si |
| Coil | Dual Zone |
| Match Mode | L-Match |
| Magnetic Shield | Yes |
| Gas Injector | Dual Zone |
| FRC | Yes |
| Liner | Symmetric Grid |
| Edge Ring | CIP version |
| ESC | Dual Zone |
| ESC Materials | Ceramic |
| Lift Pin | Ceramic |
| Turbo | 1600L/s |
| Chamber | Symmetric |
| Size(LĆWĆH) | 3279mmĆ3253mmĆ2339mm |
Automatic Ball Wire Bonder SA-BWB-6000PC
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SKU:
SA-BWB-6000PC
| Bonding Accuracy | Ā±3 Ī¼m@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm |
| Length of Wire Bonding | ā¤7mm |
| Loop Height Accuracy | Ā±25.4Ī¼m |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Bonding Force | 0~360g |
| Bonding Wire Type | Gold, Copper, CuPd, Ag, Alloy wire(18~50Ī¼m) |
| Bonding Speed | 45ms(2mm wire length) |
| Operating System | Windows |
| Optical System | Option between Ć2~Ć4 and Ć1.6~Ć3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ā„0.35MPa |
| Size(LĆWĆH) | 1000mmĆ1300mmĆ1700mm |
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Multi-chamber Intergated System SA-VKC600
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SKU:
SA-VKC600
| Number of Process Chambers(max.) | 5 |
|---|---|
| Process Chamber Type | Sputter & Degas & Pre-clean & Evaporation |
| Number of Sample Chambers(max.) | 2 |
| Autosampling Chamber | Integrated with BROOKS system |
| Ion Source | optional |
| Pumping System | Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump |
| Flow Control | Digital mass flow meter |
| Coating Uniformity | Ā±2% |
| Coating Repeatability | Ā±2% |
| Uniform Deposition Area(max.) | Ć200āÆmm |
| Ultimate Vacuum | 1E-5Pa |
| Vacuum Measurement | Full-range vacuum gauge + āCapacitance diaphragm gauge |
| Temperature Range | -80~500ā |
| Size(LĆWĆH) | 3.73mĆ2.75mĆ2.2m |
Multifunctional Manual Wire Bonder SA-MMWB-450PW
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SKU:
SA-MMWB-450PW
| Bonding Wire Type | Al(18~100Ī¼m),Au(15~75Ī¼m), Gold Ribbon(12.7 Ć 50Ī¼m~25.4 Ć 300Ī¼m),specific alloy wire |
|---|---|
| Cavity Depth | 21mm(max.) |
| Capillary Length | 19mm/25mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
