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Processing Equipments cover core manufacturing equipment for semiconductor and optoelectronic industries. With precise process control and stable performance, they support full-range, high-efficiency fabrication of various advanced electronic and optical devices.

Processing Equipments

Hot

Digital Projection Maskless Lithography System SA-UVD

In stock

SKU: SA-UVD
Wavelength
Direct-write Resolution500nm
Writing Speed10 mm2/min
Maximum Substrate Size8-inch
Substrate Thickness0.1 mm ~ 8 mm
Maximum Exposure Area200 mm × 200 mm
Grayscale Level256, 1024, 2048, 4096
Auto-focusing Range70 μm
Objective Lens5×, 10×, 20×, 50×
Writing & Slicing SoftwareSupports multiple formats including JPG, TIFF, and GDS.
Scripted Writing ModeProvides a scripted programming interface to support user-defined processing structures.
Online Drawing Processing ModeSupports real-time online drawing; allows direct drawing of custom graphics on the live sample image.
Real-time Auto-focusingOptical focusing
Electrical Conditions230VAC±5%, 50/60 Hz, 10 A
Environmental ConditionsTemperature: 21±1°C;Relative Humidity: 40%~60%, non-condensing
Compressed Air6~9 bar, tolerance±0.5 bar
Ambient LightingYellow light
Cleanliness LevelClass 1000 cleanroom
Size(L×W×H)or(D×W×H)940mm×850mm×1470mm
Weight250kg
Hot

Femtosecond Laser 3D Micro-Nano Processing Equipment for Hard-and-Brittle Materials SA-FSD-500

In stock

SKU: SA-FSD-500
Processing PositionPatterned material modification and waveguide structures
Wavelength
Objective Lens50×/20×
IlluminationReflection & Transmission
Functional ConfigurationExternal energy adjustment, 2D motorized slit
OptionalSpatial Light Modulator (SLM), auto-focus tracking
Adjustment StageManual
Travel Range of Motion Stage200 mm × 200 mm
Fixture & WorkstationLarge-area transparent adsorption stage
Hot

Femtosecond Laser Micro-Nano Automatic Processing Equipment for Fiber Bragg Gratings SA-FSD-1000IR

In stock

SKU: SA-FSD-1000IR
Processing PositionMass production of typical fiber gratings Kilometer-length fiber processing
Wavelength
Objective Lens60×
IlluminationTransmission
Functional ConfigurationExternal energy adjustment
OptionalSpatial Light Modulator (SLM), 2D motorized slit
Adjustment StageMotorized
Travel Range of Motion Stage100 mm × 100 mm
Fixture & WorkstationAutomatic fixture for fiber grating fabrication
Automatic fiber windingFull-function automatic fiber winding

Femtosecond Laser Micro-Nano Multi-Functional Processing Equipment for Fiber Bragg Gratings SA-FSD-1000M

In stock

SKU: SA-FSD-1000M
Processing PositionVarious fiber grating types
Wavelength
Objective Lens60×/20×
IlluminationReflection & Transmission
Functional ConfigurationExternal energy adjustment, 2D motorized slit
OptionalSpatial Light Modulator (SLM), galvanometer scanner
Adjustment StageMotorized
Travel Range of Motion Stage100 mm × 100 mm
Fixture & WorkstationFiber rotary fixture, oil reservoir, processing station for sheet‑shaped materials
Automatic fiber windingPartial-function automatic fiber winding
Hot

Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series

In stock

SKU: SA-MPD series
Wavelength
Lateral Minimum Feature Size Limit40 nm
Lateral Minimum Pitch Limit150 nm
Lateral Minimum Feature SizeXY ≤ 80 nm(MPD-100、MPD-1000), XY ≤ 50 nm(MPD-2000)
Lateral Minimum Pitch / ResolutionXY ≤ 300 nm(MPD-100、MPD-1000), XY ≤ 200 nm(MPD-2000)
Stitching Accuracy≤ 200 nm
Optimal Surface Roughness≤ 5 nm
High-Precision Auto-FocusingAccuracy ≤25nm, compatible with both transparent and opaque substrates including silicon, glass, and sapphire
Focusing SystemStandard: Total magnification 66×, NA 1.42(Other magnifications and specifications available upon request)
Power SupplyPower cable: 6 mm2 cross-section 220V AC, 50 Hz, 16 A
Peak Power / Operating Power4 kW/1 kW(MPD-100), 8 kW/4 kW(MPD-1000、MPD-2000)
Size(L×W×H)or(D×W×H)1300mm×1300mm×2200mm, 940mm×785mm×720mm
Cabinet Dimensions(mm, W×D×H)620×800×160
Weight<1200kg, <600kg
Intelligent Strategies1.Contour/Shell Filling; 2.Arbitrary/Custom Sequence Mode; 3.Adaptive Slicing; 4.Vector Mode
Fixture/Substrate1.Including but not limited to metal, glass (quartz), sapphire, silicon wafers; 2.Compatible with multiple substrate fixturing methods: vacuum chucking, mechanical clamping, magnetic chucking; 3.Standard/Custom optical fiber fixtures
More FunctionsAnchor points, Measurement, Fiducial marking, Tilt compensation, Rotation, etc.
Photoresist/Materials1.Self-developed two-photon photoresists, HBP, PPI-Dip, HBO-2, etc.; 2.Compatible with third-party two-photon photoresists and other photocurable materials, including but not limited to AZ series, SU-8 series; 3.Supports printing of biocompatible hydrogel materials; 4.Supports precursor photoresists for glass, PDMS and other functional materials
Average power≥ 1W
Pulse duration≤ 200 fs
Stage XYZ travel100 mm×100 mm×25 mm
High-precision Z-axisTravel ≥75 μm; minimum step size ≤ 10 nm
Environmental ConditionsYellow safelight; ISO Class 7(10,000) or better cleanroom; vibration isolation exceeding VC-C; Laboratory ambient tem- perature recommended at 21-23°C
Compressed AirNot necessary, only for active vibration isolation and vacuum stage fixtures
Hot

Tomographic Volumetric Bioprinting System SA-VOP

In stock

SKU: SA-VOP
Wavelength
Maximum Processing Sizeø40 mm×120 mm
Feature Accuracy200 μm
Processing Speed15 s~5 min/piece
Projection Resolution4K (3840×2160)
Projection Accuracy35 µm
Working Distance188 mm~221 mm
Optical Power Density64.4 mW/cm2
Maximum Rotation Speed200 r/min
Minimum Step Angle0.02°
Angular Transmission Accuracy2 arcmin (0.033°)
Repeat Positioning Accuracy±15 arcsec (0.004°)
Allowable Axial Load4000 N
XYZ Triaxial Stroke350 mm×350 mm×100 mm
XYZ Triaxial Positioning Accuracy0.1 mm
Resolution2448×2048
Pixel Size3.45 µm
Maximum Frame Rate60.0 fps
Processing Structure TypeArbitrary 3D and 2.5D structures
Applicable Consumables405 nm-responsive photocurable materials (hydrogel, GelMA, engineering resin, photocurable glass, etc.)
Other FunctionsRefractive index matching, automatic rotation axis alignment, real-time printing monitoring, automatic material assembly, etc.
Size(L×W×H)or(D×W×H)600mm×800mm×600mm
Hot

Ultraviolet Laser Direct-Write Lithography System SA-AOD-M1000

In stock

SKU: SA-AOD-M1000
Wavelength
Minimum Feature Size300nm
Overlay Accuracy300nm
Focusing Range100 μm
Long-term Power stability±1%
Maximum Supported Substrate Size8-inch standard wafer, 200 mm × 200 mm planar substrate
Supported Substrate Thickness0.1 mm ~ 15 mm
Maximum Exposure Area200 mm × 200 mm
Temperature Control Stability±0.1°C (core optical cavity constant temperature control)
Exposure Grayscale Level4096 levels, wi th high-precision exposure dose closed-loop control
UV Special Objective LensOptional magnification: 5×, 10×, 20×, 50×, 100×; flat-field apochromatic design for UV band; core numerical aperture (NA) fully matches the resolution requirements of each magnification.
Pattern Writing Layout Data Preprocessing SoftwareSupports industry-standard vector layout formats including GDSII and OASIS; provides compatible conversion and preprocessing for bitmap formats (JPG, TIFF, BMP) for auxiliary pattern design; built-in stitching, exposure dose compensation, and Optical Proximity Correction.
Electrical Conditions230VAC±5%, 50/60 Hz, 16 A,single-phase
Environmental ConditionsTemperature: 21±1°C; Relative Humidity: 40%~60%, non-condensing
Compressed Air6~9 bar, pressure fluctuation ≤ ±0.5 bar; oil-free, water-free, Class 0 clean compressed air; dew point ≤ -20°C
Ambient LightingYellow light environment (wavelength > 500 nm), no UV light leakage
Cleanroom RequirementISO Class 6 (Class 1000) cleanroom
Size(L×W×H)or(D×W×H)1320mm×1320mm×2000mm
Weight1100kg