Ultraviolet Laser Direct-Write Lithography System SA-AOD-M1000
Ultraviolet Laser Direct-Write Lithography System SA-AOD-M1000
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Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series - Image 1
Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series - Image 2
Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series - Image 3
Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series - Image 4
Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series
Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series - Image 2
Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series - Image 3
Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series - Image 4

Multi-Photon 3D Laser Direct-Write Lithography System SA-MPD series

SKU: SA-MPD series

    The SA-MPD series are true 3D maskless multi-photon 3D laser direct-write lithography systems. They fabricate arbitrary nanoscale three-dimensional structures and deliver high-precision 3D manufacturing solutions for micro-nano optics, microfluidic chips, on-chip optical interconnections and micromechanics. They support diverse photoresist and functional materials, and integrate auto-focusing, adaptive slicing, fiducial marking and tilt-compensation capabilities.

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Description

Datasheet

    The SA-MPD series are true 3D maskless multi-photon 3D laser direct-write lithography systems. They fabricate arbitrary nanoscale three-dimensional structures and deliver high-precision 3D manufacturing solutions for micro-nano optics, microfluidic chips, on-chip optical interconnections and micromechanics. They support diverse photoresist and functional materials, and integrate auto-focusing, adaptive slicing, fiducial marking and tilt-compensation capabilities.

Feature

Application
    • Nanoscale fabrication
    • True 3D structuring
    • Multi-material compatibility
    • High-precision auto-focusing
    • Micro-nano optics
    • Microfluidic chips
    • On-chip photonics
    • Micromechanical devices
Micro-And Nano-Optical Components：
Optical Fiber End-Face Structures：
Other Applications：

Specification

Features

Wavelength

General

Lateral Minimum Feature Size Limit40 nm
Lateral Minimum Pitch Limit150 nm
Lateral Minimum Feature SizeXY ≤ 80 nm(MPD-100、MPD-1000), XY ≤ 50 nm(MPD-2000)
Lateral Minimum Pitch / ResolutionXY ≤ 300 nm(MPD-100、MPD-1000), XY ≤ 200 nm(MPD-2000)
Stitching Accuracy≤ 200 nm
Optimal Surface Roughness≤ 5 nm
High-Precision Auto-FocusingAccuracy ≤25nm, compatible with both transparent and opaque substrates including silicon, glass, and sapphire
Focusing SystemStandard: Total magnification 66×, NA 1.42(Other magnifications and specifications available upon request)
Power SupplyPower cable: 6 mm2 cross-section 220V AC, 50 Hz, 16 A
Peak Power / Operating Power4 kW/1 kW(MPD-100), 8 kW/4 kW(MPD-1000、MPD-2000)
Recommended Usage Area2 m×2 m
Size(L×W×H)or(D×W×H)1300mm×1300mm×2200mm, 940mm×785mm×720mm
Cabinet Dimensions(mm, W×D×H)620×800×160
Weight<1200kg, <600kg
Intelligent Strategies1.Contour/Shell Filling; 2.Arbitrary/Custom Sequence Mode; 3.Adaptive Slicing; 4.Vector Mode
Fixture/Substrate1.Including but not limited to metal, glass (quartz), sapphire, silicon wafers; 2.Compatible with multiple substrate fixturing methods: vacuum chucking, mechanical clamping, magnetic chucking; 3.Standard/Custom optical fiber fixtures
More FunctionsAnchor points, Measurement, Fiducial marking, Tilt compensation, Rotation, etc.
Photoresist/Materials1.Self-developed two-photon photoresists, HBP, PPI-Dip, HBO-2, etc.; 2.Compatible with third-party two-photon photoresists and other photocurable materials, including but not limited to AZ series, SU-8 series; 3.Supports printing of biocompatible hydrogel materials; 4.Supports precursor photoresists for glass, PDMS and other functional materials
Average power≥ 1W
Pulse duration≤ 200 fs
Stage XYZ travel100 mm×100 mm×25 mm
High-precision Z-axisTravel ≥75 μm; minimum step size ≤ 10 nm
Environmental ConditionsYellow safelight; ISO Class 7(10,000) or better cleanroom; vibration isolation exceeding VC-C; Laboratory ambient tem- perature recommended at 21-23°C
Compressed AirNot necessary, only for active vibration isolation and vacuum stage fixtures

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