Fully automated, high-performance PECVD equipment SA-EPEE i200
Fully automated, high-performance PECVD equipment SA-EPEE i200
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General PVD System SA-Polaris BM620
General PVD System SA-Polaris BM620
General PVD System SA-eVictor AX20P - Image 1
General PVD System SA-eVictor AX20P - Image 2
General PVD System SA-eVictor AX20P - Image 3
General PVD System SA-eVictor AX20P
General PVD System SA-eVictor AX20P - Image 2
General PVD System SA-eVictor AX20P - Image 3

General PVD System SA-eVictor AX20P

SKU: SA-eVictor AX20P

      SA-eVictor AX20P is a cluster-type 6/8-inch front-side PVD system dedicated to Si/SiC power devices and advanced logic chips. It realizes sputtering deposition of Ti, TiN, AlCu, NiV and Ag for ohmic contact, barrier layer and pad metallization. With strict film uniformity below 3% and particle count under 30ea@0.3μm, the equipment has been fully validated for mass production with stable film performance and outstanding cost efficiency. 

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Description

Datasheet

SA-eVictor AX20P is a cluster-type 6/8-inch front-side PVD system dedicated to Si/SiC power devices and advanced logic chips. It realizes sputtering deposition of Ti, TiN, AlCu, NiV and Ag for ohmic contact, barrier layer and pad metallization. With strict film uniformity below 3% and particle count under 30ea@0.3μm, the equipment has been fully validated for mass production with stable film performance and outstanding cost efficiency.

Feature

Application
  • Cluster multi-chamber architecture
  • Low particle contamination
  • Mass production
  • Compatible with sputtering
  • Si/SiC Power
  • Ohmic Contact
  • Barrier Layer
  • Planarization

Principle：

3200×2700×2200 mm

3100×4400×2200 mm

Application：

Specification

Features

Wafer Size6″, 8″

General

THK mean(A)1000±50(Ni), 600±30(Ti), 1000±50(TiN), 40K±2K(Al)
Rs Mean(Ω/□)1±0.02(Ni), 11±1.0(Ti), 16±3.0(TiN), 0.75±0.05(Al)
Rs U%(WIW,%,16)< 3%
Infilm Particle< 30ea@0.3μm
Size(L×W×H)or(D×W×H)2700mm×3200mm×2200mm, 4400mm×3100mm×2200mm

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