Product – saurasemi

Electron Beam Evaporation System SA-VKE1100D/E1500D

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SKU: SA-VKE1100D/E1500D

Number of Crucibles(max.)	4
Power Supply(max.)	10kW
Film thickness monitoring	Crystal oscillator controller
Ion Source	RF & Kaufman & Hall ion source
Fixture types	Dome & Planetary
Pumping System	Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity	±2%
Coating Repeatability	±2%
Uniform Deposition Area(max.)	Ø960 mm
Ultimate Vacuum	1E-5Pa
Vacuum Measurement	Full-range vacuum gauge
Temperature Range	RT~300℃
Size(L×W×H)	4.4m×4.1m×2.6m

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Femtosecond Laser 3D Micro-Nano Processing Equipment for Hard-and-Brittle Materials SA-FSD-500

Processing Equipments, Laser Micro‑Nano Processing Equipments, Fabrication

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SKU: SA-FSD-500

Processing Position	Patterned material modification and waveguide structures
Wavelength	1030nm, 515nm
Objective Lens	50×/20×
Illumination	Reflection & Transmission
Functional Configuration	External energy adjustment, 2D motorized slit
Optional	Spatial Light Modulator (SLM), auto-focus tracking
Adjustment Stage	Manual
Travel Range of Motion Stage	200 mm × 200 mm
Fixture & Workstation	Large-area transparent adsorption stage

Automatic Deep Access Wire Bonder SA-DAWB-6000B

Wire Bonders, Automatic Wire Bonders, Packaging

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SKU: SA-DAWB-6000B

Bonding Accuracy	±3 μm@3sigma
Bonding Area	X-axis: 305 mm, Y-axis: 457 mm, rotation range: 0~180°
Ultrasonic	0~4 W precise control with stepped flexible energy output
Loop Control	Fully programmable
Cavity Depth	12mm(max.)
Bonding Force	0~220g
Capillary Length	16mm/19mm
Bonding Wire Type	Gold wire(18~75μm), copper wire (18~75 μm), selected alloy wires
Bonding Speed	≥5wires/s
Operating System	Windows
Weight	1.2T
Input Voltage	220V±10%@50~60Hz
Power	2KW
Compressed Air Requirement	≥0.35MPa
Size(L×W×H)	1500mm×1000mm×1700mm

Electron Beam Evaporation System SA-VKE360

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SKU: SA-VKE360

Number of Crucibles(max.)	6
Power Supply(max.)	10kW
Automatic Loadlocks	Single &multi-chip automatic laodlock
Workpiece Angle	-45°~45°，adjustable
Film thickness monitoring	Crystal oscillator controller
Ion Source	Hall ion source
Fixture types	Dome & Plate
Pumping System	Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity	±3%
Coating Repeatability	±2%
Uniform Deposition Area(max.)	Ø200 mm
Ultimate Vacuum	1E-5Pa
Vacuum Measurement	Full-range vacuum gauge
Temperature Range	-50~300℃
Size(L×W×H)	3.15m×2.4m×2.2m

Fully automatic cassette cleaning manchine SA-CCM-48LS

Substrate Preparation, Cleaning Machines

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SKU: SA-CCM-48LS

Wafer Size	6″, 8″
Cleaning Capacity	cassete:8pieces/batch, basket:16pieces/batch
Up Time	≥98%
MTTR	<2hrs
MTBF	≥400hrs
Control Part	PLC and HMI

Magnetron Sputter System SA-VKM360

Fabrication, PVD, Magnetron Sputter System

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SKU: SA-VKM360

Number of Cathodes(max.)	4
Sputtering Power Supply	DC / RF / pulsed DC, freely switchable
Ion Source	RF & Kaufman & Hall ion source
Bias	RF / pulsed DC
Vacuum Sampling Chamber	optional
Pumping System	Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow Control	Digital mass flow meter
Coating Uniformity	±3%
Coating Repeatability	±2%
Uniform Deposition Area(max.)	Ø150 mm
Vacuum Measurement	Full-range vacuum gauge + ‌Capacitance diaphragm gauge
Ultimate Vacuum	1E-5Pa
Temperature Range	RT~300℃
Size(L×W×H)	1.6m×2.75m×1.8m

General PVD System SA-eVictor AX20P

PVD, General PVD, Fabrication

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SKU: SA-eVictor AX20P

Wafer Size	6″, 8″
THK mean(A)	1000±50(Ni), 600±30(Ti), 1000±50(TiN), 40K±2K(Al)
Rs Mean(Ω/□)	1±0.02(Ni), 11±1.0(Ti), 16±3.0(TiN), 0.75±0.05(Al)
Rs U%(WIW,%,16)	< 3%
Infilm Particle	< 30ea@0.3μm
Size(L×W×H)	2700mm×3200mm×2200mm, 4400mm×3100mm×2200mm

Electron Beam Evaporation System SA-VKE500D

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SKU: SA-VKE500D

Number of Crucibles(max.)	6
Automatic Loadlocks	Single &multi-chip automatic laodlock
Workpiece Angle	-45°~45°，adjustable
Power Supply(max.)	10kW
Film thickness monitoring	Crystal oscillator controller
Ion Source	Kaufman & Hall ion source
Fixture types	Dome &Planetary
Pumping System	Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity	±2%
Coating Repeatability	±2%
Uniform Deposition Area(max.)	Ø260 mm
Ultimate Vacuum	1E-5Pa
Vacuum Measurement	Full-range vacuum gauge
Temperature Range	RT~500℃
Size(L×W×H)	3m×2.5m×2.2m

Dielectric Etcher SA-NMC508SDH/SDL

Fabrication, Etchers, Dielectirc Etchers

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SKU: SA-NMC508SDH/SDL

Wafer Size	6″, 8″
Etching Materials	Dielectric SiO2, Dielectric SiNx, Dielectric SiON
Processes	FEOL/BEOL(HM/CT/Spacer/Via/PAD)
SHD	Si(SDH), Al-Y2O3 coating(SDL)
Gas Injection	Dual zone inject(10-90% adj)
Temp Control	Chiller
Cathode	Dual zone ESC
Process Mode	Clean Mode(SDL)
Etch Rate(ER)	> 4500 A/min(SDH), >6000 A/min(SDL)
Sidewall Roughness	< 1 nm(SDH)
U%	WIW < 3% @ EE3mm, WTW < 3%
WPH	~ 10 @15K(SDH), 12 @10K(SDL)
COC	1
MTTR	<1h(SDH)
MTBC	> 200 RFh(SDH), > 150 RFh(SDL)
Size(L×W×H)	3279mm×3253mm×2339mm

Electron Beam Evaporation System SA-VKE1500Pro

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SKU: SA-VKE1500Pro

Number of Crucibles(max.)	8
Power Supply(max.)	10kW
Film thickness monitoring	Crystal oscillator controller
Ion Source	RF & Kaufman & Hall ion source
Fixture types	Dome & Knudsen & Planetary
Pumping System	Cryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity	±2%
Coating Repeatability	±2%
Uniform Deposition Area(max.)	12×Ø200 mm
Ultimate Vacuum	2E-5Pa
Vacuum Measurement	Full-range vacuum gauge
Temperature Range	RT~200℃
Size(L×W×H)	8.5m×5.5m×3.3m

Horizontal dryer SA-HLD-48LS

Substrate Preparation, Dryers

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SKU: SA-HLD-48LS

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