Showing 13–24 of 28 results

Fabrication

Fully automated, high-performance PECVD equipment SA-EPEE i200

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SKU: SA-EPEE i200
Wafer Size6″, 8″
Substrate TypeSi, SiC, W, TiN, Ti, TiW
Standard ConfigurationSMIFƗ3+EFEMƗ1+LLƗ2+TMƗ1+PMƗ3
Wafer StationTwins chamber, 2 pcs/chamber, max 6pcs for 3 chambers
AutomationOpen cassette/SMIF
ProcessSiO2/SiNx/TEOS/BPSG
Deposit MaterialsSiNx, SiON, TEOS SiO2, BPSG, SiO2
UniformityWIW ≤3.0%态WTW≤3.0%态RTR≤3.0%
Gas ConfigurationTEOS/TEPO/TEB/O2/SiH4/NH3/N2O/He/N2/NF3/Ar(RPS)
Cooling ModuleEFFM cooling buffer
Foot print2100Ɨ3360(7.0m2)
WPH(relative)1.20
CoC(relative)0.83
CoO(relative)0.75
Clean ModeRPS clean,>2μm/min
Size(LƗWƗH)2100mmƗ3360mmƗ2600mm

Fully automatic slot developing manchine SA-SDM-48LS

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SKU: SA-SDM-48LS
Wafer Size4″~6″
Cleaning Capacity25pieces2baskets or 4baskets/batch

General PVD System SA-eVictor AX20P

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SKU: SA-eVictor AX20P
Wafer Size6″, 8″
THK mean(A)1000±50(Ni), 600±30(Ti), 1000±50(TiN), 40K±2K(Al)
Rs Mean(Ī©/ā–”)1±0.02(Ni), 11±1.0(Ti), 16±3.0(TiN), 0.75±0.05(Al)
Rs U%(WIW,%,16)< 3%
Infilm Particle< 30ea@0.3μm
Size(LƗWƗH)2700mmƗ3200mmƗ2200mm, 4400mmƗ3100mmƗ2200mm

General PVD System SA-Polaris BM620

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SKU: SA-Polaris BM620
Wafer Size6″, 8″
THK mean(A)1500±75(Ni), 2000±100(Ti), 10K±500(Ag)
Rs Mean(Ī©/ā–”)0.6±0.1(Ni), 2.9±0.3(Ti), 0.021±0.005(Ag)
Rs U%(WIW,%,16)< 3@EE3
Infilm Particle< 30ea@0.3μm
Size(LƗWƗH)2700mmƗ3200mmƗ2200mm, 4400mmƗ3100mmƗ2200mm

Indium Evaporation System SA-VKT550I

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SKU: SA-VKT550I
Power Supply(max.)8kW
Workpiece Angle-45°~45°,adjustable
Film thickness monitoringCrystal oscillator controller
Ion SourceKaufman & Hall ion source
Fixture typesDome & Knudsen & Plate
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity±3%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ƙ300 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge
Temperature Range-80~200ā„ƒ
Size(LƗWƗH)3.3mƗ2.7mƗ2.2m

Magnetron Sputter System SA-VKM360

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SKU: SA-VKM360
Number of Cathodes(max.)4
Sputtering Power SupplyDC / RF / pulsed DC, freely switchable
Ion SourceRF & Kaufman & Hall ion source
BiasRF / pulsed DC
Vacuum Sampling Chamberoptional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±3%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ƙ150 mm
Vacuum MeasurementFull-range vacuum gauge + ā€ŒCapacitance diaphragm gauge
Ultimate Vacuum1E-5Pa
Temperature RangeRT~300ā„ƒ
Size(LƗWƗH)1.6mƗ2.75mƗ1.8m

Magnetron Sputter System SA-VKM600/M700

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SKU: SA-VKM600/M700
Number of Cathodes(max.)5
Sputtering Power SupplyDC / RF / pulsed DC, freely switchable
BiasRF / pulsed DC
Vacuum Sampling ChamberSingle-wafer / multi-wafer fully-automatic sampling chamber, optional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±2%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ƙ300 mm
Ultimate Vacuum8E-6Pa
Vacuum MeasurementFull-range vacuum gauge + ā€ŒCapacitance diaphragm gauge
Temperature Range-50~800ā„ƒ
Size(LƗWƗH)3.2mƗ3.3mƗ2.2m

Magnetron Sputter System SA-VKM800

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SKU: SA-VKM800
Number of Cathodes(max.)4
Sputtering Power SupplyDC / RF / pulsed DC, freely switchable
Ion SourceRF & Kaufman & Hall ion source
BiasRF / pulsed DC
Vacuum Sampling ChamberMulti-wafer fully-automatic sampling chamber, optional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±1.5%
Coating Repeatability±2%
Uniform Deposition Area(max.)5ƗƘ300 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge + ā€ŒCapacitance diaphragm gauge
Temperature Range-50~800ā„ƒ
Size(LƗWƗH)3.2mƗ3.3mƗ2.2m

Metal Etcher SA-NMC508SEM

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SKU: SA-NMC508SEM
Wafer Size6″, 8″
Etching MaterialsAlCu, AlSiCu, W, TiN, Ti, TiW
ProcessesTM/IM/WEB
CoilDual Coil
Match ModeFully automatic matching
Upper frequency13.56MHz
Window HeatingHeater Heating
Chamber HeatingChiller
Pump1600L/s
N2 Pressure ControlY
Throughput6K/M
MTBC350RFh
Size(LƗWƗH)3250mmƗ2580mmƗ2397mm

Multi-chamber Cluster Magnetron Sputter System SA-VKC500

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SKU: SA-VKC550
Number of Process Chambers(max.)5
Process Chamber TypeSputter & Degas & Pre-clean
Number of Sample Chambers(max.)2
Autosampling ChamberIntegrated with BROOKS system
Ion SourceDC/RF ion source, optional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±2%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ƙ300 mm
Uniform Etching Area(max.)Ƙ200 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge + ā€ŒCapacitance diaphragm gauge
Temperature Range-50~500ā„ƒ
Size(LƗWƗH)3.73mƗ2.75mƗ2.2m

Multi-chamber Intergated System SA-VKC600

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SKU: SA-VKC600
Number of Process Chambers(max.)5
Process Chamber TypeSputter & Degas & Pre-clean & Evaporation
Number of Sample Chambers(max.)2
Autosampling ChamberIntegrated with BROOKS system
Ion Sourceoptional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±2%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ƙ200 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge + ā€ŒCapacitance diaphragm gauge
Temperature Range-80~500ā„ƒ
Size(LƗWƗH)3.73mƗ2.75mƗ2.2m

Poly-Si Etcher SA-NMC508SES

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SKU: SA-NMC508SES
Wafer Size6″, 8″
Etching MaterialsSi, PolySi
ProcessesPoly EB/STI/Poly gate/CT Si
CoilDual Zone
Match ModeL-Match
Magnetic ShieldYes
Gas InjectorDual Zone
FRCYes
LinerSymmetric Grid
Edge RingCIP version
ESCDual Zone
ESC MaterialsCeramic
Lift PinCeramic
Turbo1600L/s
ChamberSymmetric
Size(LƗWƗH)3279mmƗ3253mmƗ2339mm