Showing 13–24 of 29 results

Fabrication

Hot

Fully automated, high-performance PECVD equipment SA-EPEE i200

In stock

SKU: SA-EPEE i200
Wafer Size6″, 8″
Standard ConfigurationSMIF×3+EFEM×1+LL×2+TM×1+PM×3
Wafer StationTwins chamber, 2 pcs/chamber, max 6pcs for 3 chambers
AutomationOpen cassette/SMIF
ProcessSiO2/SiNx/TEOS/BPSG
Deposit MaterialsBPSG, SiNx, SiO2, SiON, TEOS SiO2
UniformityWIW ≤3.0%、WTW≤3.0%、RTR≤3.0%
Gas ConfigurationTEOS/TEPO/TEB/O2/SiH4/NH3/N2O/He/N2/NF3/Ar(RPS)
Cooling ModuleEFFM cooling buffer
Foot print2100×3360(7.0m2)
WPH(relative)1.20
CoC(relative)0.83
CoO(relative)0.75
Clean ModeRPS clean,>2μm/min
Size(L×W×H)2100mm×3360mm×2600mm

Fully automatic slot developing manchine SA-SDM-48LS

In stock

SKU: SA-SDM-48LS
Wafer Size4″~6″
Cleaning Capacity25pieces2baskets or 4baskets/batch

General PVD System SA-eVictor AX20P

In stock

SKU: SA-eVictor AX20P
Wafer Size6″, 8″
THK mean(A)1000±50(Ni), 600±30(Ti), 1000±50(TiN), 40K±2K(Al)
Rs Mean(Ω/□)1±0.02(Ni), 11±1.0(Ti), 16±3.0(TiN), 0.75±0.05(Al)
Rs U%(WIW,%,16)< 3%
Infilm Particle< 30ea@0.3μm
Size(L×W×H)2700mm×3200mm×2200mm, 4400mm×3100mm×2200mm

General PVD System SA-Polaris BM620

In stock

SKU: SA-Polaris BM620
Wafer Size6″, 8″
THK mean(A)1500±75(Ni), 2000±100(Ti), 10K±500(Ag)
Rs Mean(Ω/□)0.6±0.1(Ni), 2.9±0.3(Ti), 0.021±0.005(Ag)
Rs U%(WIW,%,16)< 3@EE3
Infilm Particle< 30ea@0.3μm
Size(L×W×H)2700mm×3200mm×2200mm, 4400mm×3100mm×2200mm

Indium Evaporation System SA-VKT550I

In stock

SKU: SA-VKT550I
Power Supply(max.)8kW
Workpiece Angle-45°~45°,adjustable
Film thickness monitoringCrystal oscillator controller
Ion SourceKaufman & Hall ion source
Fixture typesDome & Knudsen & Plate
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Coating Uniformity±3%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ø300 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge
Temperature Range-80~200℃
Size(L×W×H)3.3m×2.7m×2.2m

Magnetron Sputter System SA-VKM360

In stock

SKU: SA-VKM360
Number of Cathodes(max.)4
Sputtering Power SupplyDC / RF / pulsed DC, freely switchable
Ion SourceRF & Kaufman & Hall ion source
BiasRF / pulsed DC
Vacuum Sampling Chamberoptional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±3%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ø150 mm
Vacuum MeasurementFull-range vacuum gauge + ‌Capacitance diaphragm gauge
Ultimate Vacuum1E-5Pa
Temperature RangeRT~300℃
Size(L×W×H)1.6m×2.75m×1.8m

Magnetron Sputter System SA-VKM600/M700

In stock

SKU: SA-VKM600/M700
Number of Cathodes(max.)5
Sputtering Power SupplyDC / RF / pulsed DC, freely switchable
BiasRF / pulsed DC
Vacuum Sampling ChamberSingle-wafer / multi-wafer fully-automatic sampling chamber, optional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±2%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ø300 mm
Ultimate Vacuum8E-6Pa
Vacuum MeasurementFull-range vacuum gauge + ‌Capacitance diaphragm gauge
Temperature Range-50~800℃
Size(L×W×H)3.2m×3.3m×2.2m

Magnetron Sputter System SA-VKM800

In stock

SKU: SA-VKM800
Number of Cathodes(max.)4
Sputtering Power SupplyDC / RF / pulsed DC, freely switchable
Ion SourceRF & Kaufman & Hall ion source
BiasRF / pulsed DC
Vacuum Sampling ChamberMulti-wafer fully-automatic sampling chamber, optional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±1.5%
Coating Repeatability±2%
Uniform Deposition Area(max.)5ר300 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge + ‌Capacitance diaphragm gauge
Temperature Range-50~800℃
Size(L×W×H)3.2m×3.3m×2.2m

Metal Etcher SA-NMC508SEM

In stock

SKU: SA-NMC508SEM
Wafer Size6″, 8″
Etching MaterialsAlCu, AlSiCu, Ti, TiN, TiW, W
ProcessesTM/IM/WEB
CoilDual Coil
Match ModeFully automatic matching
Upper frequency13.56MHz
Window HeatingHeater Heating
Chamber HeatingChiller
Pump1600L/s
N2 Pressure ControlY
Throughput6K/M
MTBC350RFh
Size(L×W×H)3250mm×2580mm×2397mm

Multi-chamber Cluster Magnetron Sputter System SA-VKC500

In stock

SKU: SA-VKC500
Process Chamber TypeSputter & Degas & Pre-clean
Autosampling ChamberIntegrated with BROOKS system
Ion SourceDC/RF ion source, optional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±2%
Coating Repeatability±2%
Uniform Etching Area(max.)Ø200 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge + ‌Capacitance diaphragm gauge
Temperature Range-50~500℃
Size(L×W×H)3.73m×2.75m×2.2m
Hot

Multi-chamber Intergated System SA-VKC600

In stock

SKU: SA-VKC600
Process Chamber TypeSputter & Degas & Pre-clean & Evaporation
Autosampling ChamberIntegrated with BROOKS system
Ion Sourceoptional
Pumping SystemCryopump / magnetically levitated turbo-molecular pump + Dry mechanical pump
Flow ControlDigital mass flow meter
Coating Uniformity±2%
Coating Repeatability±2%
Uniform Deposition Area(max.)Ø200 mm
Ultimate Vacuum1E-5Pa
Vacuum MeasurementFull-range vacuum gauge + ‌Capacitance diaphragm gauge
Temperature Range-80~500℃
Size(L×W×H)3.73m×2.75m×2.2m

Poly-Si Etcher SA-NMC508SES

In stock

SKU: SA-NMC508SES
Wafer Size6″, 8″
Etching MaterialsPolySi, Si
ProcessesPoly EB/STI/Poly gate/CT Si
CoilDual Zone
Match ModeL-Match
Magnetic ShieldYes
Gas InjectorDual Zone
FRCYes
LinerSymmetric Grid
Edge RingCIP version
ESCDual Zone
ESC MaterialsCeramic
Lift PinCeramic
Turbo1600L/s
ChamberSymmetric
Size(L×W×H)3279mm×3253mm×2339mm